Electrode configuration in a MEMS switch

• US 20040032705A1
• Filed: 08/14/2002
• Published: 02/19/2004
• Est. Priority Date: 08/14/2002
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Ma, Qing
• Granted Patent: US 6,850,133 B2
• Time in Patent Office: Days
• US Class Current: 361/233
• CPC Class Codes: H01H 59/0009 making use of micromechanics

Abstract

A microelectromechanical system (MEMS) switch that includes a signal contact, an actuation electrode and a beam that engages the signal contact when a voltage is applied to the actuation electrode. The signal contact includes a first portion and a second portion. The actuation electrode is positioned between the first and second portions of the signal contact.

Claims

1. A MEMS switch comprising:

a signal contact including a first portion and a second portion;

an actuation electrode positioned between the first and second portions of the signal contact; and

a beam that engages the signal contact when a voltage is applied to the actuation electrode.

2. The MEMS switch of claim 1, wherein the beam is a bridge beam.

3. The MEMS switch of claim 1, wherein the beam includes a plurality of protuberances that engage the signal contact.

4. The MEMS switch of claim 1, wherein the signal contact includes an input contact and an output contact.

5. The MEMS switch of claim 4, wherein the input contact is connected to the output contact by the beam when a voltage is applied to the actuation electrode.

6. The MEMS switch of claim 5, wherein at least one of the input and output contacts includes a body and projections extending from the body with the projections positioned under the beam, the actuation electrode being positioned between the projections.

7. The MEMS switch of claim 5, wherein each of the input and output contacts includes a body and projections extending from the respective bodies with the projections positioned under the beam, the actuation electrode being positioned between the projections on the input and output contacts.

8. The MEMS switch of claim 4, wherein the input contact is electrically connected to the output contact by two segments and the actuation electrode is positioned between the segments.

9. The MEMS switch of claim 4, wherein the input contact is electrically connected to the output contact by a plurality of segments, and the actuation electrode includes a plurality of electrically connected pads, each pad on the actuation electrode being positioned between a unique pair of segments on the signal contact.

10. The MEMS switch of claim 1, wherein the actuation electrode includes an inner pad positioned between the first and second portions of the signal contact and at least one outer pad positioned outside the first and second portions of the signal contact.

11. The MEMS switch of claim 10, wherein the pads of the actuation electrode are under the beam.

12. The MEMS switch of claim 10, wherein the inner pad is electrically connected to each outer pad.

13. The MEMS switch of claim 12, further comprising a substrate, wherein the signal contact and the inner and outer pads are mounted on a surface of the substrate.

14. The MEMS switch of claim 13, wherein the inner and outer pads are electrically coupled by a connecting pad positioned below the surface of the substrate.

15. The MEMS switch of claim 14, wherein the inner and outer pads are electrically connected to the connecting pad by vias.

16. The MEMS switch of claim 1, wherein the signal contact is covered with a dielectric layer that engages the beam when a voltage is applied to the actuation electrode.

17. The MEMS switch of claim 16, wherein the actuation electrode is covered with a dielectric layer.

18. A MEMS switch comprising:

a substrate including a surface;

a signal contact on the surface the substrate, the signal contact including a first portion and a second portion;

an actuation electrode including an inner pad positioned under the beam and between the first and second portions of the signal contact, at least one outer pad positioned under the beam and outside the first and second portions of the signal contact, and a connecting pad positioned below the surface of the substrate to electrically connect the inner and outer pads; and

a bridge beam that includes a plurality of protuberances to engage the signal contact when a voltage is applied to the actuation electrode.

19. The MEMS switch of claim 18, wherein the signal contact includes an input contact and an output contact that is connected to the input contact by the beam when a voltage is applied to the actuation electrode.

20. The MEMS switch of claim 18, wherein the signal contact includes an input contact and an output contact that is electrically connected to the input contact by a plurality of segments.

21. A computer system comprising:

a bus;

a memory coupled to the bus;

an electronic assembly connected to the bus, the electronic assembly including a MEMS switch having a signal contact, an actuation electrode and a beam that engages the signal contact when a voltage is applied to the actuation electrode, the signal contact including a first portion and a second portion with the actuation electrode positioned between the first and second portions of the signal contact.

22. The system of claim 21, wherein the actuation electrode and signal contact are covered with a dielectric layer.

23. The system of claim 21, wherein the beam is a bridge beam.