Polished polyimide substrate

• US 20040033006A1
• Filed: 05/02/2003
• Published: 02/19/2004
• Est. Priority Date: 04/17/1998
• Status: Active Grant

• Current Assignee: John Farah
• Original Assignee: John Farah
• Inventors: Farah, John
• Granted Patent: US 6,807,328 B2
• Time in Patent Office: Days
• US Class Current: 385/14
• CPC Class Codes: G02B 2006/12176 Etching
• CPC Class Codes: G02B 6/138 by using polymerisation
• CPC Class Codes: G02B 6/30 for use between fibre and thin-film device
• CPC Class Codes: G02B 6/3636 the mechanical coupling means being grooves G02B6/3652 takes precedence
• CPC Class Codes: G02B 6/364 inverted grooves, e.g. dovetails
• CPC Class Codes: G02B 6/3652 the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
• CPC Class Codes: G02B 6/3688 using laser ablation
• CPC Class Codes: G02B 6/3692 with surface micromachining involving etching, e.g. wet or dry etching steps surface micromachining involving subtractive techniques B81C1/00055
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42

Abstract

Polymer substrates, in particular polyimide substrates, and polymer laminates for optical applications are described. Polyimide substrates are polished to an average surface roughness of about 0.25 μinch, and single-layer or multi-layer waveguide structures are deposited on the polished polyimide substrates. Laminates including polymer or a hybrid organic/inorganic waveguiding film can be deposited on a polished polyimide substrate. The laminate can also include ceramic, piezoelectric and metallic layers. Optical waveguide devices are machined by laser ablation using a combination of IR and UV lasers. A waveguide-fiber coupler with a laser-machined groove for holding the fiber is also disclosed.

Claims

1. A substrate for a circuit structure comprising:

a planar substrate mass of polyimide material having a first side and a second side, said first side being polished to a surface smoothness between about 0.025 μ

inch and 0.5 μ

inch, capable of receiving a circuit structure.

2. The substrate for a circuit structure of claim 1, wherein said surface smoothness is between about 0.25 μ

inch and 0.5 μ

inch.