Optic semiconductor module and manufacturing method
First Claim
1. An optic semiconductor module comprising:
- a main board of an approximately planar plate shape having an aperture therethrough and a plurality of board metal patterns formed at a periphery of the aperture;
a package portion coupled to the main board, the package portion having a laser diode for converting an electric signal to an optical signal and a photo detector for converting an optical signal to an electric signal, wherein the laser diode and the photo detector are electrically coupled to the main board through the board metal patterns; and
an optical fiber inserted into the aperture of the main board, an end of the optical fiber being disposed adjacent to the package portion.
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Accused Products
Abstract
An optic semiconductor package includes a main board of a substantially planar plate shape. The main board includes an aperture therethrough and a plurality of board metal patterns formed at the periphery of the aperture. A package portion is coupled to the main board. The package portion includes a base, a laser diode and a photo detector electrically coupled to the board metal patterns of the main board and bonded to the base. An optical fiber is inserted into the aperture of the main board and disposed adjacent the package portion. The position and tilt of the optical fiber may be adjusted to achieve optimum optical coupling between the optical fiber and the laser diode and the optical fiber and the photo detector. The optical fiber is stably attached to the main board by an adhesive.
72 Citations
20 Claims
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1. An optic semiconductor module comprising:
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a main board of an approximately planar plate shape having an aperture therethrough and a plurality of board metal patterns formed at a periphery of the aperture;
a package portion coupled to the main board, the package portion having a laser diode for converting an electric signal to an optical signal and a photo detector for converting an optical signal to an electric signal, wherein the laser diode and the photo detector are electrically coupled to the main board through the board metal patterns; and
an optical fiber inserted into the aperture of the main board, an end of the optical fiber being disposed adjacent to the package portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of manufacturing an optic semiconductor module, the method comprising:
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providing a cap type substrate comprising a base having inside surfaces defining a space within the base and defining an opening at the lower part of the base;
forming a plurality of substrate metal patterns;
forming and adhesive layer on first portions of the inside surfaces and an outside surface of the base;
attaching the plurality of substrate metal patterns to the first portions of the inside surfaces and the outside surface of the base by means of the adhesive layer;
bonding a laser diode and a photo detector to a second portion of the inside surfaces of the base;
connecting the laser diode and the photo detector to the plurality of substrate metal patterns by means of conductive wires;
positioning a glass within the opening in the lower part of the base;
attaching the glass to a perimeter edge of the opening by means of a glass attach material;
providing a main board of an approximately planar plate shape, the main board having an aperture therethrough and a plurality of board metal patterns formed at a periphery of the aperture; and
electrically connecting the substrate metal patterns of the cap type substrate to the board metal patterns of the main board. - View Dependent Claims (12, 13)
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14. An optic semiconductor module comprising:
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a main board having an aperture therethrough and a plurality of board metal patterns formed at a periphery of the aperture;
a package portion coupled to the main board;
a laser diode bonded to the package portion;
a photo detector bonded to the package portion; and
wherein the laser diode and the photo detector are electrically coupled to the main board through the board metal patterns. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification