Three-dimensional intergrated inductor, its module and fabrication method of the same
First Claim
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1. A three dimensional adjustable high frequency inductor comprising a plurality of jointed pads fixed on a substrate;
- a metallic pattern for a lower layer inductor extendable to said jointed pads;
a metallic pattern for an upper layer inductor also extendable to said jointed pads; and
an intermediate metallic part interconnecting said upper and said lower metallic patterns.
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Abstract
A three dimensional adjustable high frequency inductor, its module and fabrication method of the same; the high frequency module comprises micro high frequency inductors, filters, resistors, capacitors and associated with active components or power components to form a hybrid circuit, then it is packaged by using the technology of flip chip or wafer level packaging, so as to upgrade properties of high frequency modules and reduce the packaging and instrumentation costs by minimizing the modular size.
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Citations
19 Claims
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1. A three dimensional adjustable high frequency inductor comprising
a plurality of jointed pads fixed on a substrate; -
a metallic pattern for a lower layer inductor extendable to said jointed pads;
a metallic pattern for an upper layer inductor also extendable to said jointed pads; and
an intermediate metallic part interconnecting said upper and said lower metallic patterns.
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2. A method for of fabricating a three dimensional adjustable high frequency inductor, comprising the steps of:
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providing a substrate;
forming a first metallic pattern on said substrate;
forming a first dielectric layer uniformly covering said first metallic pattern;
removing part of said first dielectric layer in a defined region to form an empty hole, and filling said empty hole with a second dielectric layer;
defining said second dielectric layer, and forming a second metallic pattern to interconnect said upper and said lower metallic patterns; and
forming a third metallic pattern on the entire structure as the topmost metallic pattern of said high frequency inductor, and to make electrical communication with other circuital components. - View Dependent Claims (3, 4, 5, 6)
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7. A method of fabricating a three dimensional adjustable high frequency inductor, comprising the steps of:
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providing a substrate;
forming a sustaining layer on said substrate;
forming a first metallic pattern on said sustaining layer;
forming a first dielectric layer uniformly covering said first metallic pattern;
removing part of said first dielectric layer in a defined region to form an empty hole, and filing said empty hole with a second dielectric layer;
defining said second dielectric layer, and forming a second metallic pattern to interconnect said upper and said lower metallic patterns;
forming a third metallic pattern on the entire structure as the topmost metallic pattern of said high frequency inductor, and to make electrical connection with other circuital components; and
removing said substrate with an etchant to form a blank cavity. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A method of fabricating a three dimensional adjustable high frequency inductor, comprising the steps of:
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providing a substrate;
depositing and defining a resistor layer on said substrate;
depositing and by etching or lifting-off method to define two terminals of said resistor, and a first metallic pattern to serve as a lower electrode of a capacitor;
depositing and defining a first dielectric layer and a second metallic pattern;
forming a second dielectric layer for isolation on said resistor and said capacitor;
forming a third metallic pattern on said second dielectric layer;
forming a third dielectric layer uniformly covering said third metallic pattern;
removing said third dielectric layer and filling with a fourth dielectric layer in a defined region;
defining said fourth dielectric layer and forming a fourth metallic pattern to interconnect the upper and the lower metallic patterns; and
forming a fifth metallic pattern on the entire structure as the topmost metallic pattern of said high frequency inductor, and for electrical connection with other circuital components. - View Dependent Claims (14, 15, 16)
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17. A method of fabricating a three dimensional high frequency inductor, comprising the steps of:
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providing a first substrate;
forming circuit units such as a capacitor unit, a resistor unit, and an inductor unit on said first substrate; and
combining a second substrate containing circuit unit with crystal stabilized or wafer level packing through metal conductors and jointing nodes. - View Dependent Claims (18, 19)
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Specification