Heat sink for surface mounted power devices

• US 20040037044A1
• Filed: 08/21/2002
• Published: 02/26/2004
• Est. Priority Date: 08/21/2002
• Status: Abandoned Application

• Current Assignee: Vanner, Inc. (Vanner Holdings, Inc.)
• Original Assignee: Vanner, Inc. (Vanner Holdings, Inc.)
• Inventors: Campbell, James G., Humphries, John, Speck, Stephen D., Cook, Alexander, Isurin, Alexander
• Application Number:
  US10/225,373
• Publication Number:
  US 20040037044A1
• Time in Patent Office: Days
• US Class Current: 361/719
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the printed circuit board [PCB]
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 3/42 Plated through-holes or plated via connections

Abstract

An improved heat sink for surface mounted power devices. According to one embodiment of the invention, the electrical contacts of a surface mounted power device are soldered to printed circuit board solder pads. The opposite, non-component, side of the printed circuit board is provided with thermal transfer pads, which are aligned in a parallel plane with the solder pads on the component side of the printed circuit board. The solder pads and thermal transfer pads are connected together by a number of plated through holes which provide a thermal conduction path. The thermal transfer pads are placed in proximity to a heat sink such that a high thermal conductivity exists between the surface mounted power device and the heat sink, allowing heat generated by the surface mounted power device to be conducted to the heat sink and dissipated. A thermal interface material may be used to improve thermal conductivity between the thermal transfer pads and the heat sink. A brace may also be used to apply pressure on the printed circuit board and heat sink to maximize conductivity and facilitate the transfer of heat away from the surface mounted power devices.

Claims

1. An apparatus for cooling a surface mounted power device, comprising:

a printed circuit board having a first side and a second side;

a solder pad placed on said first side of said printed circuit board, said solder pad being arranged to couple to corresponding electrical contacts of a surface mounted power device;

a thermal transfer pad placed on said second side of said printed circuit board, said thermal transfer pad being aligned with said solder pad in parallel planes;

a plurality of plated through holes located at said solder pad and extending therethrough said printed circuit board, said plated through holes communicating with said solder pad and said thermal transfer pad; and

a thermally conductive heat sink, said heat sink being placed in proximity to said thermal transfer pad for conducting heat away from said surface mounted power device.

2. The apparatus of claim 1 further including an enclosure for said printed circuit board, said heat sink forming one or more exterior surfaces of said enclosure.

3. The apparatus of claim 1 wherein a portion of said plated through holes contain a thermally conductive filler.

4. The apparatus of claim 1 wherein portions of said solder pad and said thermal transfer pad are covered with a solder resist.

5. The apparatus of claim 1 further including a thermal interface material positioned intermediate and in facing contact with said thermal transfer pad and said heat sink.

6. The apparatus of claim 5 further comprising a brace, said brace being located over said surface mounted power device and securable to said heat sink such that when secured said brace compresses said thermal transfer pad and said heat sink into substantially uniform and compressed contact with said thermal interface material.

7. The apparatus of claim 5 wherein said thermal interface material is electrically insulative.

8. The apparatus of claim 5 wherein said thermal interface material is a thermally conductive adhesive.

9. An apparatus for cooling surface mounted power devices within an enclosure, comprising:

a printed circuit board mountable within said enclosure having a first side and a second side;

a plurality of solder pads placed on said first side of said printed circuit board, said solder pads being shaped to couple to a body of corresponding surface mounted power devices;

a plurality of thermal transfer pads placed on said second side of said printed circuit board, said thermal transfer pads being aligned with said solder pads in parallel planes;

a plurality of plated through holes located at said solder pads and extending therethrough said printed circuit board, said plated through holes communicating with said solder pads and said thermal transfer pads; and

a thermally conductive heat sink, said heat sink being positioned on the second side of said printed circuit board in proximity to said thermal transfer pads, for conducting heat away from any said surface mounted power devices.

10. The apparatus of claim 9 wherein said heat sink forms at least one exterior surface of said enclosure.

11. The apparatus of claim 9 wherein a portion of said plated through holes contain solder.

12. The apparatus of claim 9 wherein said solder pads and thermal transfer pads are comprised of annular rings coaxially aligned with said plated through holes.

13. The apparatus of claim 9 further comprising a thermally conductive adhesive located between said body of said surface mounted power devices and said solder pads.

14. The apparatus of claim 9 further including a thermal interface material positioned between said thermal transfer pads and said heat sink to increase thermal conductivity between said thermal transfer pads and said heat sink.

15. The apparatus of claim 14 further comprising a brace, said brace being located over said surface mounted power devices and securable to said heat sink such that when secured said brace compresses said thermal transfer pads and said heat sink into substantially uniform and compressed contact with said thermal interface material.

16. The apparatus of claim 14 wherein said thermal interface material is electrically insulative.

17. The apparatus of claim 14 wherein said thermal interface material is a thermally conductive adhesive.

18. The apparatus of claim 14 wherein said thermal interface material is resilient.

19. An apparatus for cooling surface mounted power devices within an enclosure, comprising:

a printed circuit board having a first side and a second side;

a plurality of solder pads placed on said first side of said printed circuit board, said solder pads being shaped to couple to a set of electrical contacts and a body of a surface mounted power device;

a plurality of thermal transfer pads placed on said second side of said printed circuit board, said thermal transfer pads being aligned with said solder pads in parallel planes;

a plurality of plated through holes located at said solder pads and extending therethrough said printed circuit board, said plated through holes communicating with said solder pads and said thermal transfer pads; and

a thermally conductive heat sink, said heat sink being placed in proximity to said thermal transfer pads, said heat sink conducting heat away from said surface mounted power device.

20. An apparatus for cooling surface mounted power devices within an enclosure, comprising:

a printed circuit board having a first side and a second side;

a plurality of solder pads placed on said first side of said printed circuit board, said solder pads being shaped to couple to a set of electrical contacts and a body of a surface mounted power device;

a plurality of thermal transfer pads placed on said second side of said printed circuit board, said thermal transfer pads being aligned with said solder pads in parallel planes;

a plurality of plated through holes located at said solder pads and extending therethrough said printed circuit board, said plated through holes communicating with said solder pads and said thermal transfer pads;

a thermally conductive heat sink, said heat sink being located on said second side in proximity to said thermal transfer pads, for conducting heat away from said surface mounted power device;

a resilient thermal interface material positioned between said thermal transfer pads and said heat sink; and

a brace, said brace being located over said surface mounted power device and securable to said heat sink such that when secured said brace compresses said thermal transfer pads and said heat sink into substantially uniform and compressed contact with said thermal interface material.

21. A method for conducting heat away from surface mounted power devices within an enclosure, comprising:

providing a printed circuit board having a first side and a second side;

placing a plurality of solder pads on said first side of said printed circuit board, and shaping said solder pads to couple to a set of electrical contacts of a surface mounted power device;

placing a plurality of thermal transfer pads on said second side of said printed circuit board and aligning said thermal transfer pads with said solder pads in parallel planes;

installing a plurality of plated through holes at said solder pads such that said plated through holes extend through said printed circuit board and communicate with said solder pads and said thermal transfer pads; and

placing a thermally conductive heat sink in proximity to said thermal transfer pads, for conducting heat away from said surface mounted power device.

22. A method for conducting heat away from surface mounted power devices within an enclosure, comprising:

providing a printed circuit board having a first side and a second side;

placing a plurality of solder pads on said first side of said printed circuit board, and shaping said solder pads to couple to a body of a surface mounted power device;

placing a plurality of thermal transfer pads on said second side of said printed circuit board and aligning said thermal transfer pads with said solder pads in parallel planes;

installing a plurality of plated through holes at said solder pads such that said plated through holes extend through said printed circuit board and communicate with said solder pads and said thermal transfer pads; and

placing a thermally conductive heat sink in proximity to said thermal transfer pads and conducting heat away from said surface mounted power device.

23. A method for conducting heat away from surface mounted power devices within an enclosure, comprising:

providing a printed circuit board having a first side and a second side;

placing a plurality of solder pads on said first side of said printed circuit board, and shaping said solder pads to couple to a set of electrical contacts and a body of a surface mounted power device;

placing a plurality of thermal transfer pads on said second side of said printed circuit board and aligning said thermal transfer pads with said solder pads in parallel planes;

installing a plurality of plated through holes at said solder pads such that said plated through holes extend through said printed circuit board and communicate with said solder pads and said thermal transfer pads; and

placing a thermally conductive heat sink in proximity to said thermal transfer pads and conducting heat away from said surface mounted power device;

arranging a resilient thermal interface material between said thermal transfer pads and said heat sink; and

locating a brace that is securable to said heat sink over said surface mounted power device such that when secured said brace compresses said thermal transfer pads and said heat sink into substantially uniform and compressed contact with said thermal interface material.