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Heat sink for surface mounted power devices

  • US 20040037044A1
  • Filed: 08/21/2002
  • Published: 02/26/2004
  • Est. Priority Date: 08/21/2002
  • Status: Abandoned Application
First Claim
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1. An apparatus for cooling a surface mounted power device, comprising:

  • a printed circuit board having a first side and a second side;

    a solder pad placed on said first side of said printed circuit board, said solder pad being arranged to couple to corresponding electrical contacts of a surface mounted power device;

    a thermal transfer pad placed on said second side of said printed circuit board, said thermal transfer pad being aligned with said solder pad in parallel planes;

    a plurality of plated through holes located at said solder pad and extending therethrough said printed circuit board, said plated through holes communicating with said solder pad and said thermal transfer pad; and

    a thermally conductive heat sink, said heat sink being placed in proximity to said thermal transfer pad for conducting heat away from said surface mounted power device.

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