Wafer handling system

• US 20040037675A1
• Filed: 08/15/2003
• Published: 02/26/2004
• Est. Priority Date: 09/27/2000
• Status: Active Grant

• Current Assignee: Christianus Gm De Ridder, Jan Zinger
• Original Assignee: Christianus Gm De Ridder, Jan Zinger
• Inventors: De Ridder, Christianus G. M., Zinger, Jan
• Granted Patent: US 6,981,832 B2
• Time in Patent Office: Days
• US Class Current: 414/217
• CPC Class Codes: H01L 21/67379 characterised by coupling elements, kinematic members, handles or elements to be externally gripped
• CPC Class Codes: H01L 21/67386 characterised by the construction of the closed carrier
• CPC Class Codes: H01L 21/67757 vertical transfer of a batch of workpieces
• CPC Class Codes: H01L 21/67769 Storage means
• CPC Class Codes: H01L 21/67775 Docking arrangements
• CPC Class Codes: H01L 21/67781 Batch transfer of wafers

Abstract

A system for processing semiconductor wafers includes adaptations allowing the selective handling of cassettes for both 200-mm wafers and 300-mm wafers. The system is configured initially for handling standard 300-mm FOUP cassettes. Adaptions for handling 200-mm wafer open cassettes include a load port adapter frame for receiving such cassettes on a input/output platform; a cassette handler adapter configured for reversibly mounting on a cassette handler end effector and for receiving 200-mm open cassettes; a store adapter frame for converting 300-mm FOUP storage compartments into compartments for storing 200-mm open cassettes; and a Transhipment FOUP for holding 200-mm open cassettes upon a cassette transfer platform and bringing such cassettes into an interface with a wafer handler. The Transhipment FOUP has outer surfaces resembling a standard 300-mm FOUP cassette, but is configured to receive a 200-mm open cassette therein.

Claims

1. A wafer processing system configured for handling standard 300-mm FOUP cassettes, the system comprising:

an input/output station;

a cassette transfer region adjacent to the input/output station;

a wafer handling chamber adjacent to the cassette transfer region, the wafer handling chamber separated from the cassette transfer region by an interface configured for interacting with a 300-mm FOUP cassette;

a cassette transfer mechanism configured for transferring cassettes from the input/output station through the cassette transfer region to the interface;

a wafer handling robot within the wafer handling chamber, the wafer handling robot configured to access wafers within cassettes through the interface; and

a tool set adapted for receiving and transferring 200-mm open cassettes within the wafer processing system.

2. The wafer processing system of claim 1, wherein the interface comprises a partition between the cassette transfer region and the wafer handling chamber, the partition having a closable opening therein mating with a 300-mm FOUP cassette.

3. The wafer processing system of claim 1, wherein the cassette transfer mechanism comprises a cassette handler robot configured to transfer cassettes between the input/output station and the cassette transfer region.

4. The wafer processing system of claim 3, wherein the tool set comprises a Transhipment FOUP cassette having external surfaces conforming to a 300-mm FOUP cassette standard, the Transhipment FOUP cassette comprising an internal platform configured to receive a 200-mm open cassette.

5. The wafer processing system of claim 4, further comprising a storage position within the cassette transfer region to store the Transhipment FOUP cassette when not in use.

6. The wafer processing system of claim 3, wherein the cassette transfer mechanism further comprises a cassette transfer platform configured to receive cassettes from the cassette handler robot and place cassettes into an active position accessible by the wafer transfer robot through the interface.

7. The wafer processing system of claim 6, wherein the cassette transfer platform comprises a turntable.

8. The wafer processing system of claim 3, wherein the cassette handler robot has a bearing surface designed to receive a standard 300-mm FOUP cassette, the wafer processing system further comprising a cassette handler adapter configured to fit on the bearing surface, the cassette handler adapter further configured to accommodate a 200-mm open cassette thereon.

9. The wafer processing system of claim 8, further comprising a storage position to store the cassette handler adapter when not in use.

10. The wafer processing system of claim 9, wherein the storage position is on the cassette handler robot.

11. The wafer processing system of claim 9, further comprising a cassette store accessible to the cassette handler robot, the storage position for storing the cassette handler adapter comprising a designated position within the cassette store.

12. The wafer processing system of claim 3, further comprising a cassette store within the cassette transfer region, the cassette store accessible to the cassette handler robot, the cassette store comprising a storage platform having a plurality of 300-mm FOUP store positions.

13. The wafer processing system of claim 12, wherein the tool set comprises a store accommodation plate, configured to fit on one of the 300-mm FOUP store positions, the store accommodation plate configured to accommodate at least one 200-mm open cassette.

14. The wafer processing system of claim 13, wherein the store accommodation plate is configured to accommodate two 200-mm open cassettes.

15. The wafer processing system of claim 12, wherein the store comprises a plurality of stacked rotary storage platforms, each platform divided into a plurality of storage compartments and defining the 300-mm FOUP store positions.

16. The wafer processing system of claim 1, wherein the tool set comprises a load port adapter plate configured to fit on a position of the input/output station designed to receive a standard 300-mm FOUP cassette, the load port adapter plate configured to accommodate a 200-mm open cassette thereon.

17. The wafer processing system of claim 4, further comprising a sensor arrangement to determine presence of a 200-mm cassette at discrete positions within the wafer processing system, the sensor arrangement capable of distinguishing presence of a 300-mm FOUP cassette from presence of a 200-mm open cassette at the discrete locations.

18. The wafer processing system of claim 17, wherein the sensor arrangement is capable of distinguishing presence of a standard 300-mm FOUP cassette from presence of the Transhipment FOUP cassette at a discrete location.

19. The wafer processing system of claim 17, wherein the sensor arrangement includes a plurality of light sensors, light emitters, reflectors and a central processing unit.

20. The wafer processing system of claim 19, wherein the cassette handler robot includes an end effector with a bearing surface configured to receive a standard 300-mm FOUP cassette, the wafer processing system further comprising a cassette handler adapter configured to fit on the bearing surface of the cassette handler robot, the cassette handler adapter further configured to accommodate a 200-mm open cassette thereon, wherein the sensor arrangement comprises at least one light sensor and one light emitter arranged to detect the cassette handler adapter when mounted upon the bearing surface of the cassette handler robot.

21. The wafer processing system of claim 20, wherein the sensors communicate with the central processing unit and the central processing unit is provided with a program instructing the cassette handler robot to automatically pick up the cassette handler adapter when needed for transferring a 200-mm open cassette, the program further instructing the cassette hander robot to store the cassette hander adapter when not needed for transferring a 200-mm open cassette.

22. The wafer processing system of claim 20, wherein the sensors communicate with the central processing unit and the central processing unit is provided with a program instructing the cassette handler robot to automatically place a 200-mm open cassette inside the Transhipment FOUP when wafers need to be transferred from the 200-mm open cassette to the wafer transfer robot or vice versa, the program further instructing the cassette handler robot to remove the 200-mm open cassette when transfer of wafers between the 200-mm open cassette and the wafer handler robot is complete.

23. The wafer processing system of claim 20, wherein

the bearing surface of the cassette handler robot has at least one sensor hole,

the cassette handler adapter includes a depending vane aligned with the sensor hole when the cassette handler adapter is mounted upon the bearing surface of the cassette handler robot, and

the sensor arrangement includes a sensor for detecting the vane extending downwardly through the sensor hole when the cassette handler adapter is mounted upon the bearing surface of the cassette handler robot.