Method of creating a color optoelectronic device

• US 20040037949A1
• Filed: 06/30/2003
• Published: 02/26/2004
• Est. Priority Date: 06/01/2000
• Status: Abandoned Application

• Current Assignee: Noble Venture Finance Limited
• Original Assignee: Noble Venture Finance Limited
• Inventors: Wright, Jeffrey Peter
• Application Number:
  US10/296,648
• Publication Number:
  US 20040037949A1
• Time in Patent Office: Days
• US Class Current: 427/66
• CPC Class Codes: H10K 59/35 comprising red-green-blue [RGB] subpixels
• CPC Class Codes: H10K 71/13 using printing techniques, e.g. ink-jet printing or screen printing
• CPC Class Codes: H10K 71/20 Changing the shape of the active layer in the devices, e.g. patterning

Abstract

A method of creating an array of organic light emitting diode pixels comprises the steps of providing a mold (12) including recesses (15) for defining pixels and conduits (13, 14) leading to the recesses, positioning the mold (12) so that the recesses (15) are on a substrate, filling the recesses by means of the conduits (13, 14) with a liquid comprising an organic light emitting material, allowing the liquid in the recesses (15) to form into solid pixel structures, and removing the mold to leave the desired pixel array. A color array can be formed by sequentially forming pixels which emit light of different primary colors, for example using a different mold for each color.

Claims

1. A method of creating an array of organic light emitting diode pixels, comprising the steps of:

providing a mold including recesses for defining pixels and conduits leading to the recesses,

positioning the mold so that the recesses are on a substrate,

filling the recesses by means of the conduits with a liquid comprising an organic light emitting material,

allowing the liquid in the recesses to form into solid pixel structures, and

removing the mold to leave the desired pixel array.

2. A method as claimed in claim 1, wherein the organic light emitting material comprises a polymer.

3. A method as claimed in claim 1, wherein the organic light emitting material comprises a small molecule material.

4. A method as claimed in claim 2 or 3, wherein the organic light emitting material is in solution in a solvent.

5. A method as claimed in claim 4, wherein the organic light emitting material forms solid-state structures by evaporation of the solvent.

6. A method as claimed in claim 2 or 3, wherein the organic light emitting material is in a pure form that flows and can be transformed to a non-flowing solid-state structure while in situ in the mold.

7. A method as claimed in claim 2 or 3, wherein the organic light emitting material is incorporated within a flowing material that can be transformed to a non-flowing solid-state structure while in situ in the mold.

8. A method as claimed in claim 6, wherein the flowing material comprises a monomer, elastomer, crosslinking or polymerizing liquid crystal mixture, or a combination thereof.

9. A method as described in any preceding claim, where the liquid filling the mold changes to a solid-state structure by the action of at least one of heat, ultra-violet, x-ray, and gamma ray exposure.

10. A method as claimed in any preceding claim, comprising a preliminary step of casting the mold against a master that has a patterned upper surface, from which master the mold forms a pattern in relief.

11. A method as claimed in claim 10, wherein the mold is made from an elastomer, monomer or prepolymer which is hardened or polymerized in situ on the master.

12. A method as claimed in claim 11, wherein the mold is polymerized into a polymer, for example, poly(dimethylsiloxane) or poly(methylmethacrylate).

13. A method as claimed in any one of claims 1 to 10, wherein the mold is of a ceramic material.

14. A method as claimed in any preceding claim, wherein the conduits are filled from a single access hole leading to all of the conduits.

15. A method as claimed in any one of claims 1 to 13, wherein the conduits are filled from a series of access holes in the mold.

16. A method as claimed in claim 14 or 15, wherein a reservoir of the liquid flowing into the mold is created around the access hole or holes.

17. A method as claimed in any preceding claim, wherein all of the conduits and recesses in the mold are filled with the same liquid.

18. A method as claimed in claim 17, comprising further steps of:

providing at least one further mold including further recesses for defining further pixels and further conduits leading to the further recesses,

positioning the at least one further mold so that the further recesses are on the substrate,

filling the further recesses by means of the further conduits with a further liquid comprising a further organic light emitting material,

allowing the further liquid in the further recesses to form into further solid pixel structures, and

removing the at least one further mold to leave the desired pixel array including said further pixel structures.

19. A method as claimed in any one of claims 1 to 17, wherein the mold includes a plurality of separate networks of conduits each leading to a set of recesses and each set of recesses is filled via its respective network of conduits with a liquid comprising a different organic light emitting material, thus creating an array of different pixel structures comprising the different organic light emitting materials.

20. A method as claimed in claim 19, wherein access holes in the mold for filling said networks of conduits are blocked and unblocked using lithography to allow sequential filling.

21. A method as claimed in any preceding claim, wherein a non-light emitting material is introduced into the space between and around adjacent light emitting materials in the pixel array and molded onto the substrate.

22. A method as claimed in claim 21, comprising the steps of:

providing a mold including a recesses for defining the space into which the non-light emitting material is to be introduced and at a conduit leading to the recess,

positioning the mold so that the recess is in place on the substrate,

filling the recess by means of the conduit with a liquid comprising the non-light emitting material,

allowing the liquid in the recess to form into a solid structure, and

removing the mold to leave the desired structure.

23. A method as claimed in any preceding claim, wherein filling of the mold by the liquid takes place by capillary action.

24. A method as claimed in claim 23, wherein a vacuum environment is created around the mold and then reduced to a partial vacuum by the controlled introduction of a gas to aid the capillary filling of the mold.

25. A method as claimed in any one of claims 1 to 23, wherein a high pressure environment is created around the mold by introducing gas to aid the filling of the mold.

26. A method as claimed in claim 24 or 25, wherein the gas introduced is an inert gas such as argon or nitrogen.

27. A method as claimed in claim 24 or 25, wherein the gas introduced is a gas which is reactive with either oxygen or water vapor, for example, trimethyl aluminum.

28. A method as claimed in any preceding claim, wherein the substrate and the mold are provided with interengaging means to aid controlled positioning of the mold.

29. A method as claimed in any preceding claim, wherein the mold is flushed with an appropriate solvent prior to filling with the liquid.

30. An optoelectronic device comprising an array of organic light emitting diode pixels created by the method of any preceding claim.