Manufacturing process for array plate assembly

• US 20040038388A1
• Filed: 05/02/2003
• Published: 02/26/2004
• Est. Priority Date: 12/19/2001
• Status: Abandoned Application

• Current Assignee: Affymetrix, Inc. (Thermo Fisher Scientific Incorporated)
• Original Assignee: Affymetrix, Inc. (Thermo Fisher Scientific Incorporated)
• Inventors: Spence, Eric J., Yamamoto, Melvin
• Application Number:
  US10/428,626
• Publication Number:
  US 20040038388A1
• Time in Patent Office: Days
• US Class Current: 435/287.2
• CPC Class Codes: B01J 19/0046 Sequential or parallel reactions, e.g. for the synthesis of polypeptides or polynucleotides; Apparatus and devices for combinatorial chemistry or for making molecular arrays synthesis methods per se C40B50/00
• CPC Class Codes: B01J 2219/00315 Microtiter plates
• CPC Class Codes: B01J 2219/00317 Microwell devices, i.e. having large numbers of wells
• CPC Class Codes: B01J 2219/00364 Pipettes
• CPC Class Codes: B01J 2219/00432 Photolithographic masks
• CPC Class Codes: B01J 2219/00497 Features relating to the solid phase supports
• CPC Class Codes: B01J 2219/005 Beads
• CPC Class Codes: B01J 2219/00504 Pins
• CPC Class Codes: B01J 2219/00527 Sheets
• CPC Class Codes: B01J 2219/00574 radioactive
• CPC Class Codes: B01J 2219/00576 fluorophore
• CPC Class Codes: B01J 2219/00578 electrophoric
• CPC Class Codes: B01J 2219/00585 Parallel processes
• CPC Class Codes: B01J 2219/00596 Solid-phase processes
• CPC Class Codes: B01J 2219/00605 the compounds being directly bound or immobilised to solid supports
• CPC Class Codes: B01J 2219/0061 The surface being organic
• CPC Class Codes: B01J 2219/00612 the surface being inorganic
• CPC Class Codes: B01J 2219/00617 by chemical means
• CPC Class Codes: B01J 2219/00626 Covalent
• CPC Class Codes: B01J 2219/00641 the porous medium being continuous, e.g. porous oxide substrates
• CPC Class Codes: B01J 2219/00662 : Two-dimensional arrays within two-dimensional arrays
• CPC Class Codes: B01J 2219/00675 : In-situ synthesis on the substrate
• CPC Class Codes: B01J 2219/00689 : using computers
• CPC Class Codes: B01J 2219/00691 : using robots
• CPC Class Codes: B01J 2219/00704 : integrated with the reactor apparatus
• CPC Class Codes: B01J 2219/00711 : Light-directed synthesis
• CPC Class Codes: B01J 2219/00722 : Nucleotides
• CPC Class Codes: B01J 2219/00725 : Peptides
• CPC Class Codes: B01J 2219/00729 : Peptide nucleic acids [PNA]
• CPC Class Codes: B01L 2200/12 : Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0636 : Integrated biosensor, microarrays
• CPC Class Codes: B01L 2300/0829 : Multi-well plates; Microtitration plates
• CPC Class Codes: B01L 3/5085 : for multiple samples, e.g. microtitration plates
• CPC Class Codes: B29C 65/00 : Joining or sealing of preformed parts , e.g. welding of plastics materials; Apparatus therefor general aspects of processes or apparatus for joining preformed parts B29C66/00; using porous material formed by internal pressure generated therein for joining preformed parts B29C44/1228, B29C44/326
• CPC Class Codes: B29C 65/02 : by heating, with or without pressure
• CPC Class Codes: B29C 65/18 : using heated tools
• CPC Class Codes: B29C 65/4845 : Radiation curing adhesives, e.g. UV light curing adhesives
• CPC Class Codes: B29C 65/56 : using mechanical means or mechanical connections, e.g. form-fits
• CPC Class Codes: B29C 65/568 : using a swaging operation, i.e. totally deforming the edge or the rim of a first part to be joined to clamp a second part to be joined
• CPC Class Codes: B29C 66/112 : Single lapped joints
• CPC Class Codes: B29C 66/114 : Single butt joints
• CPC Class Codes: B29C 66/234 : said joint lines being in the form of tessellations
• CPC Class Codes: B29C 66/30223 : said melt initiators being rib-like
• CPC Class Codes: B29C 66/324 : Avoiding burr formation
• CPC Class Codes: B29C 66/53461 : joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
• CPC Class Codes: B29C 66/55 : sealing elements being incorporated into the joints, e.g. gaskets B29C66/52296 takes precedence
• CPC Class Codes: B29C 66/61 : Joining from or joining on the inside for making tubes by bending sheets and joining from the inside B29C53/387
• CPC Class Codes: B29C 66/71 : characterised by the composition of the plastics material of the parts to be joined welding bar compositions B29C65/125
• CPC Class Codes: B29K 2023/06 : PE, i.e. polyethylene
• CPC Class Codes: B29K 2025/06 : PS, i.e. polystyrene
• CPC Class Codes: B29K 2027/16 : PVDF, i.e. polyvinylidene fluoride
• CPC Class Codes: B29K 2027/18 : PTFE, i.e. polytetrafluorethene , e.g. ePTFE, i.e. expanded polytetrafluorethene
• CPC Class Codes: B29K 2033/08 : Polymers of acrylic acid esters, e.g. PMA, i.e. polymethylacrylate
• CPC Class Codes: B29K 2033/12 : Polymers of methacrylic acid esters, e.g. PMMA, i.e. polymethylmethacrylate
• CPC Class Codes: B29K 2055/02 : ABS polymers, i.e. acrylonitrile-butadiene-styrene polymers
• CPC Class Codes: B29K 2995/0069 : non-permeable
• CPC Class Codes: B29L 2031/756 : Microarticles, nanoarticles
• CPC Class Codes: B82Y 30/00 : Nanotechnology for materials or surface science, e.g. nanocomposites

Abstract

In one embodiment, a method is provided for manufacturing an array plate consisting of several different arrays.

Claims

1. A method of manufacturing an array plate comprising the steps of:

selecting a plurality of arrays;

transferring the plurality of arrays to a holding plate;

applying adhesive to-a well plate;

transferring the plurality of arrays from the holding plate to the well plate to assemble an array plate.

2. The method of claim 1 wherein the plurality of arrays is selected from at least one wafer.

3. The method of claim 1 wherein the holding plate may be constructed by a plurality of subplates.

4. The method of claim 1 wherein the plurality of arrays may be selected from a plurality of wafers so as to assemble any combination of arrays into a single array plate.

5. The method of claim 1 wherein the adhesive is distributed into a glue stamper with the use of a glue manifold before applying the adhesive to the well plate.

6. The method of claim 1 wherein the glue stamper is an elastomeric plate.

7. The method of claim 1 further comprising curing the array plate;

8. The method of claim 1 wherein the adhesive is UV curable.

9. The method of claim 1 wherein the holding plate can be arranged into a 96-chip format.

10. The method of claim 1 wherein the transferring of the plurality of arrays is done with the use of the a pick-up plate.

11. The method of claim 1 wherein the array plate is disassembled for individual pounching an labeling.

12. An array plate comprising:

a plurality of arrays;

a body comprising a plurality of cavities wherein the body is open at two ends;

and wherein the body has a plurality of pockets at the perimeter of each well at one of the ends and wherein the pockets have high borders;

said plurality of arrays transferred to a holding plate;

said plurality of arrays fixedly connected to the body with the use of an adhesive;

wherein the adhesive is applied to the body with the use of glue stamper.

13. The array plate of claim 12 wherein the plurality of arrays is selected from at least one wafer.

14. The array plate of claim 12 wherein the holding plate may be constructed by a plurality of subplates.

15. The array plate of claim 14 wherein the plurality of subplates are molded with thermoplastic materials.

16. The array plate of claim 14 wherein the plurality of subplates are manufactures with snap-in features for assembly.

17. The array plate of claim 12 wherein the adhesive is distributed on the glue stamper with a glue manifold.

18. The array plate of claim 12 wherein the adhesive is UV curable.

19. The array plate of claim 12 wherein the array plate can be arranged into a 96-chip format