Piezoelectric composite apparatus and a method for fabricating the same

• US 20040040132A1
• Filed: 09/03/2003
• Published: 03/04/2004
• Est. Priority Date: 10/29/1999
• Status: Active Grant

• Current Assignee: The Government Of The United States Of America, As Represented By The Secretary Of The Navy
• Original Assignee: U.S.A. as represented by the Administrator of the National Aeronautics and Space Administration
• Inventors: Mirick, Paul H., Jalink, Antony Jr., Fox, Robert L., Bryant, Robert G., High, James W., Wilkie, W. Keats, Hellbaum, Richard F., Little, Bruce D.
• Granted Patent: US 7,197,798 B2
• Time in Patent Office: Days
• US Class Current: 29/25.35
• CPC Class Codes: H04R 17/005 using a piezoelectric polymer
• CPC Class Codes: H10N 30/06 Forming electrodes or interconnections, e.g. leads or terminals
• CPC Class Codes: H10N 30/092 Forming composite materials
• CPC Class Codes: H10N 30/1061 based on piezoelectric or electrostrictive fibres
• CPC Class Codes: H10N 30/206 using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
• CPC Class Codes: H10N 30/208 using shear or torsion displacement, e.g. d15 type devices
• CPC Class Codes: H10N 30/702 based on piezoelectric or electrostrictive fibres
• CPC Class Codes: H10N 30/87 Electrodes or interconnections, e.g. leads or terminals
• CPC Class Codes: Y10T 156/1044 of parallel stacked sheets only
• CPC Class Codes: Y10T 156/1092 All laminae planar and face to face
• CPC Class Codes: Y10T 156/1093 with covering of discrete laminae with additional lamina
• CPC Class Codes: Y10T 156/1095 Opposed laminae are running length webs
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/435 Solid dielectric type
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/49007 Indicating transducer
• CPC Class Codes: Y10T 29/4908 Acoustic transducer
• CPC Class Codes: Y10T 29/49083 Heater type
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

A method for fabricating a piezoelectric macro-fiber composite actuator comprises making a piezoelectric fiber sheet by providing a plurality of wafers of piezoelectric material, bonding the wafers together with an adhesive material to form a stack of alternating layers of piezoelectric material and adhesive material, and cutting through the stack in a direction substantially parallel to the thickness of the stack and across the alternating layers of piezoelectric material and adhesive material to provide at least one piezoelectric fiber sheet having two sides comprising a plurality of piezoelectric fibers in juxtaposition to the adhesive material. The method further comprises bonding two electrically conductive films to the two sides of the piezoelectric fiber sheet. At least one conductive film has first and second conductive patterns formed thereon which are electrically isolated from one another and in electrical contact with the piezoelectric fiber sheet.

Claims

1. A method of fabricating a piezoelectric composite apparatus, comprising the steps of:

providing a plurality of wafers of piezoelectric material;

bonding the wafers together with an adhesive material to form a stack of alternating layers of piezoelectric material and adhesive material, the stack having a thickness;

cutting through the stack in a direction substantially parallel to the thickness of the stack and across the alternating layers of piezoelectric material and adhesive material to provide at least one piezoelectric fiber sheet comprising a plurality of piezoelectric fibers in juxtaposition to adhesive material, the at least one piezoelectric fiber sheet having a first side and a second side;

providing a first film having a first conductive pattern and a second conductive pattern formed thereon, the first conductive pattern being electrically isolated from the second conductive pattern, the first and second conductive patterns each having a plurality of electrodes that cooperate to form a pattern of interdigitated electrodes;

providing a second film;

bonding the second film to the second side of the at least one piezoelectric fiber sheet; and

bonding the first film to the first side of the at least one piezoelectric fiber sheet such that the conductive patterns of the first film electrically contact the piezoelectric fibers of the at least one piezoelectric fiber sheet.

2. The method according to claim 1 wherein the wafer of piezoelectric material comprises a monolithic piezoelectric material.

3. The method according to claim 1 wherein each piezoelectric fiber has a substantially rectangular cross-section.

4. The method according to claim 1 wherein at least one of the conductive patterns is made of copper.

5. The method according to claim 1 wherein the second film has a first conductive pattern and a second conductive pattern, the first conductive pattern of the second film being electrically isolated from the second conductive pattern of the second film, the first and second conductive patterns of the second film each having a plurality of electrodes that cooperate to form a pattern of interdigitated electrodes, and the step of bonding the first film further comprises the step of positioning the first film so that the conductive patterns of the first film are substantially aligned with the conductive patterns of the second film.

6. The method according to claim 5 further comprising attaching electrically conductive extensions to the first and second conductive patterns of the first film and attaching electrically conductive extensions to the first and second conductive patterns of the second film.

7. The method according to claim 1 wherein the step of bonding the second film further comprises applying an epoxy to the at least one piezoelectric fiber sheet.

8. The method according to claim 5 wherein the first film and the second film each have a longitudinally extending axis and the step of cutting produces at least one piezoelectric sheet having a plurality of piezoelectric fibers that extend in the direction of the longitudinal axes of the first and second films.

9. The method according to claim 8 wherein each interdigitated electrode of the first and second conductive patterns extends in a direction that is substantially perpendicular to the longitudinally extending axes of the first and second films and substantially perpendicular to the longitudinally extending direction of the plurality of piezoelectric fibers.

10. The method according to claim 1 wherein the second film has a first side and a second side, and the step of bonding the second film comprises:

applying an adhesive layer to the first side of the second film;

placing the first side of the second film on the second side of the at least one piezoelectric fiber sheet; and

curing the adhesive layer.

11. The method according to claim 10 wherein the first film has a first side and a second side, and the step of bonding the first film comprises:

applying a second adhesive layer to the first side of the first film;

placing the first side of the first film on the first side of the at least one piezoelectric fiber sheet; and

curing the second adhesive layer.

12. The method according to claim 1 further comprising the step of attaching electrically conductive extensions to the first and second conductive patterns.

13. A method of fabricating a plurality of piezoelectric fibers, comprising the steps of:

providing a plurality of wafers of piezoelectric material;

bonding the wafers together with an adhesive material between each wafer to form a stack of alternating layers of piezoelectric material and adhesive material, the stack having a thickness; and

cutting through the stack in a direction substantially parallel to the thickness of the stack and across the alternating layers of piezoelectric material and adhesive material to provide at least one piezoelectric fiber sheet comprising a plurality of piezoelectric fibers in juxtaposition to the adhesive material.

14. The method according to claim 13 wherein the wafer of piezoelectric material comprises a monolithic piezoelectric material.

15. The method according to claim 13 wherein each piezoelectric fiber has a substantially rectangular cross-section.

16. A piezoelectric composite apparatus made by a process comprising:

providing a plurality of wafers of piezoelectric material;

bonding the wafers together with an adhesive material to, form a stack of alternating layers of piezoelectric material and adhesive material, the stack having a thickness;

cutting through the stack in a direction substantially parallel to the thickness of the stack and across the alternating layers of piezoelectric material and adhesive material to provide at least one piezoelectric fiber sheet comprising a plurality of piezoelectric fibers in juxtaposition to adhesive material, the at least one piezoelectric fiber sheet having a first side and a second side;

providing a first film having a first conductive pattern and a second conductive pattern formed thereon, the first conductive pattern being electrically isolated from the second conductive pattern, the first and second conductive patterns each having a plurality of electrodes that cooperate to form a pattern of interdigitated electrodes;

providing a second film;

bonding the second film to the second side of the at least one piezoelectric fiber sheet; and

bonding the first film to the first side of the at least one piezoelectric fiber sheet such that the conductive patterns of the first film electrically contact the piezoelectric fibers of the at least one piezoelectric fiber sheet.

17. The apparatus according to claim 16 wherein the wafer of piezoelectric material comprises a monolithic piezoelectric material.

18. The apparatus according to claim 16 wherein each piezoelectric fiber has a substantially rectangular cross-section.

19. The apparatus according to claim 16 wherein at least one of the conductive patterns is made of copper.

20. The apparatus according to claim 16 wherein the second film has a first conductive pattern and a second conductive pattern, the first conductive pattern of the second film being electrically isolated from the second conductive pattern of the second film, the first and second conductive patterns of the second film each having a plurality of electrodes that cooperate to form a pattern of interdigitated electrodes, and the step of bonding the first film further comprises the step of positioning the first film so that the conductive patterns of the first film are substantially aligned with the conductive patterns of the second film.

21. The apparatus according to claim 20 further comprising attaching electrically conductive extensions to the first and second conductive patterns of the first film and attaching electrically conductive extensions to the first and second conductive patterns of the second film.

22. The apparatus according to claim 16 wherein the step of bonding the second film further comprises applying an epoxy to the at least one piezoelectric fiber sheet.

23. The apparatus according to claim 20 wherein the first film and the second film each have a longitudinally extending axis and the step of cutting produces at least one piezoelectric fiber sheet having a plurality of piezoelectric fibers that extend in the direction of the longitudinal axes of the first and second films.

24. The apparatus according to claim 23 wherein each interdigitated electrode of the first and second conductive patterns extends in a direction that is substantially perpendicular to the longitudinally extending axes of the first and second films and substantially perpendicular to the longitudinally extending direction of the plurality of piezoelectric fibers.

25. The apparatus according to claim 16 wherein the second film has a first side and a second side, and the step of bonding the second film comprises:

applying an adhesive layer to the first side of the second film;

placing the first side of the second film on the second side of the at least one piezoelectric fiber sheet; and

curing the adhesive layer.

26. The apparatus according to claim 25 wherein the first film has a first side and a second side, and the step of bonding the first film comprises:

applying a second adhesive layer to the first side of the first film;

placing the first side of the first film on the first side of the at least one piezoelectric fiber sheet; and

curing the second adhesive layer.

27. The apparatus according to claim 16 wherein the process for making the piezoelectric composite apparatus further comprises the step of attaching electrically conductive extensions to the first and second conductive patterns.

28. A plurality of piezoelectric fibers made by a process comprising:

providing a plurality of wafers of piezoelectric material;

bonding the wafers together with an adhesive material between each wafer to form a stack of alternating layers of piezoelectric material and adhesive material, the stack having a thickness; and

cutting through the stack in a direction substantially parallel to the thickness of the stack and across the alternating layers of piezoelectric material and adhesive material to provide at least one piezoelectric fiber sheet.

29. The plurality of piezoelectric fibers according to claim 28 wherein the wafer of piezoelectric material comprises a monolithic piezoelectric material.

30. The plurality of piezoelectric fibers according to claim 28 wherein each piezoelectric fiber has a substantially rectangular cross-section.