Modular capillary pumped loop cooling system

• US 20040040695A1
• Filed: 08/26/2003
• Published: 03/04/2004
• Est. Priority Date: 09/20/2001
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Chesser, Jason B., Montgomery, Stephen W., Faneuf, Barrett M.
• Granted Patent: US 7,770,630 B2
• Time in Patent Office: Days
• US Class Current: 165/104.21
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/043 forming loops, e.g. capillary pumped loops
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 7/20009 using a gaseous coolant in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954
• CPC Class Codes: H05K 7/20809 within server blades for removing heat from heat source

Abstract

A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

Claims

15. A condenser, comprising:

a single coil of tubing having a helical configuration and including an inlet port to receive a working fluid in a vapor state and an outlet port from which the working fluid exits the condenser in a liquid state; and

a plurality of fins disposed about a centerline of the single coil of tubing.

16. The condenser of claim 15, further comprising a low-profile centrifugal fan disposed within the single coil of tubing and operatively coupled to the single coil of tubing, said low-profile centrifugal fan including a motor coupled to a fan rotor comprising a plurality of fan blades that when rotated by the motor cause air to flow over the plurality of fins to assist in removing heat from the condenser.

18-1. The thin-profile condenser of claim 18, further comprising a hole extending through the condensing region.

19-2. The thin-profile condenser of claim 18, wherein said at least one internal wall includes wall portions that are configured so as to thermally isolate the capillary channel from the condensing region.

26. An evaporator, comprising

a base in which a cavity is defined within a peripheral portion thereof and configured to be thermally coupled to a semiconductor heat source;

a top cover secured to the peripheral portion of the base so as to define a sealed volume in which a working fluid is vaporized;

a liquid inlet port to receive the working fluid in a liquid state, operatively coupled to the sealed volume;

a vapor liquid inlet port from which the working fluid exits the evaporator in a vapor state, operatively coupled to the sealed volume; and

a wicking structure, disposed within a portion of the cavity, having a top surface on which a meniscus of the working fluid is formed and a bottom surface into which the working fluid is drawn through a capillary mechanism and a pressure differential between a pressure of the working fluid in the meniscus and a pressure of vaporized working fluid in the sealed volume.

27. The evaporator of claim 26, further comprising a plurality of structural elements extending between the base and the top cover so as to prevent the sealed volume from collapsing when the evaporator is operated such that evaporation of the working fluid occurs under sub-atmospheric conditions.

28. The evaporator of claim 26, wherein the wicking structure comprises a volume of a sintered material.

29. The evaporator of claim 27, wherein the sintered material comprises a sintered copper.

30. The evaporator of claim 27, wherein each of the base and the top cover comprise stamped metal components.