Semiconductor package for series-connected diodes
First Claim
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1. A semiconductor device package comprising:
- a first diode having an anode electrode and a cathode electrode;
a second diode having an anode electrode and a cathode electrode; and
a common conductive pad;
wherein said cathode electrode of said first diode is electrically connected to said anode electrode of said second diode by said common conductive pad.
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Abstract
Two series-connected diodes which are housed in a power package (such as but not limited to TO220, TO220FP, D2pak, TO247, etc.).
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Citations
9 Claims
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1. A semiconductor device package comprising:
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a first diode having an anode electrode and a cathode electrode;
a second diode having an anode electrode and a cathode electrode; and
a common conductive pad;
wherein said cathode electrode of said first diode is electrically connected to said anode electrode of said second diode by said common conductive pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification