Please download the dossier by clicking on the dossier button x
×

Flip-chip image sensor packages and methods of fabrication

  • US 20040041247A1
  • Filed: 07/03/2003
  • Published: 03/04/2004
  • Est. Priority Date: 08/29/2002
  • Status: Active Grant
First Claim
Patent Images

1. An electronic device package comprising:

  • a transparent substrate;

    a secondary substrate having a first surface secured to a surface of the transparent substrate, having a central aperture covered by the transparent substrate and a plurality of conductive traces formed around the central aperture, each conductive trace of the plurality of conductive traces having a first attachment point and a second attachment point on a second surface of the secondary substrate;

    an optically interactive electronic device having at least one bond pad, the optically interactive electronic device mounted to the secondary substrate by a bond between the first attachment point of a conductive trace of the plurality of conductive traces and the at least one bond pad; and

    a discrete conductive element attached to the second attachment point of the conductive trace, the discrete conductive element extending outwardly from the secondary substrate within an outside perimeter thereof from the second attachment point in a direction perpendicular to a plane of the secondary substrate and to a level beyond a back surface of the optically interactive electronic device.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×