Inlet for an electronic tag

• US 20040041262A1
• Filed: 08/06/2003
• Published: 03/04/2004
• Est. Priority Date: 08/28/2002
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Technology Corporation (Renesas Electronics Corporation)
• Inventors: Ikeda, Yuji, Saito, Takeshi, Morinaga, Yuichi, Okamoto, Michio
• Granted Patent: US 7,105,916 B2
• Time in Patent Office: Days
• US Class Current: 257/737
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Abstract

Provided are an inlet for an electronic tag comprising an insulating film, antennas each made of a conductor layer and formed over one surface of the insulating film, a slit formed in a portion of each of the antennas and having one end extending toward the outer edge of the antenna, a semiconductor chip electrically connected with each of the antennas via a plurality of bump electrodes, and a resin for sealing the semiconductor chip therewith; and a manufacturing process of the inlet. By the present invention, formation of a thin and highly-reliable inlet for a non-contact type electronic tag can be actualized.

Claims

1. An inlet for an electronic tag comprising:

an insulating film;

antennas each made of a conductor layer and formed over one surface of the insulating film;

a slit formed in a portion of each of the antennas and having one end extending to the outer edge of the antenna;

a semiconductor chip electrically connected to each of the antennas via a plurality of bump electrodes; and

a resin for sealing the semiconductor chip therewith.

2. An inlet for an electronic tag according to claim 1, wherein the antennas each made of a conductor layer are formed by patterning a copper foil or an aluminum foil formed over one surface of the insulating film.

3. An inlet for an electronic tag according to claim 1, wherein the semiconductor chip is disposed inside of a device hole formed in the insulating film and is sealed with a potting resin.

4. An inlet for an electronic tag according to claim 1, wherein the plurality of bump electrodes for electrically connecting each of the antennas with the semiconductor chip include a dummy bump not electrically connected to a circuit in the semiconductor chip.

5. An inlet for an electronic tag according to claim 4, wherein the plurality of bump electrodes have one bump electrode constituting an input terminal of the circuit, another bump electrode constituting a GND terminal of the circuit, and two dummy bump electrodes not electrically connected to the circuit.

6. An inlet for an electronic tag according to claim 5, wherein the bump electrode constituting the input terminal of the circuit is electrically connected to one half of each of the antennas obtained by dividing the antenna into two by the slit and the another bump electrode constituting the GND terminal of the circuit is electrically connected to the other half of the antenna.

7. An inlet for an electronic tag according to claim 1, wherein the plurality of bump electrodes are electrically connected to leads formed integral with each of the antennas, respectively, and the leads each extends in a direction perpendicular to the long side direction of each of the antennas.

8. An inlet for an electronic tag according to claim 1, wherein a cover film for protecting each of the antennas and the semiconductor chip is stacked over the one surface of the insulating film.

9. A manufacturing process of an inlet for an electronic tag comprising:

an insulating film;

antennas made of a conductor layer and formed over one surface of the insulating film;

a slit formed in a portion of each of the antennas and having one end extending toward the outer edge of the antenna;

a semiconductor chip electrically connected to each of the antennas via a plurality of bump electrodes; and

a resin for sealing the semiconductor chip therewith, comprising the steps of;

(a) preparing a long insulating film in which a plurality of antennas made of a conductor layer are formed so as to be separated from each other;

(b) connecting a semiconductor chip to each of the plurality of antennas formed in the insulating film;

(c) sealing, with a resin, the semiconductor chip connected to each of the plurality of antennas; and

(d) inspecting the quality of the inlet for an electronic tag manufactured by the steps (a), (b) and (c),

wherein the long insulating film is carried from the step (a) to the step (d) in the form wound onto a reel.

10. A manufacturing process of an inlet for an electronic tag according to claim 9, further comprising, after the step (d), a step of shipping the long insulating film in the form wound onto a reel.

11. An inlet for an electronic tag comprising:

an insulating film;

antennas each made of a conductor layer and formed over one surface of the insulating film;

a slit formed in a portion of each of the antennas and having one end extending toward the outer edge of the antenna;

a semiconductor chip electrically connected to each of the antennas via a plurality of bump electrodes; and

a resin for sealing the semiconductor chip therewith,

wherein a cutout is disposed in a portion of each of the antennas for exposing the insulating film,

wherein a plurality of lead patterns which are each made of the conductor film and has one end connected to each of the antennas and the other end extending inside of the cutout are formed inside of the cutout, and

wherein the plurality of bump electrodes are connected to the surfaces of the lead patterns formed at positions corresponding to the bump electrodes, respectively.

12. An inlet for an electronic tag according to claim 11, wherein the conductor film is made of a copper film formed over one surface of the insulating film and a tin plating layer formed over the surface of the copper film, and the bump electrodes are metal bumps.

13. An inlet for an electronic tag according to claim 11, wherein the plurality of bump electrodes include a bump electrode constituting an input terminal of a circuit formed over the semiconductor chip, another bump electrode constituting a GND terminal of the circuit, and a dummy bump electrode not electrically connected to the circuit.

14. An inlet for an electronic tag according to claim 11, wherein the plurality of lead patterns have the same area.

15. An inlet for an electronic tag according to claim 11, wherein the width of each of the plurality of lead patterns is greater than the diameter of the bump electrode.

16. An inlet for an electronic tag according to claim 11, wherein an organic resin film is formed over the surface of the semiconductor chip.

17. An inlet for an electronic tag according to claim 11, wherein the resin for sealing the semiconductor chip is, at the outermost edge of the resin, brought into contact with the antenna outside the cutout.

18. An inlet for an electronic tag according to claim 17, wherein the diameter of the semiconductor chip is greater than that of the cutout.