PCB heatsink

• US 20040042179A1
• Filed: 08/27/2002
• Published: 03/04/2004
• Est. Priority Date: 08/27/2002
• Status: Abandoned Application

• Current Assignee: Ascom Energy Systems AG
• Original Assignee: Ascom Energy Systems AG
• Inventors: Murphy, Patrick Kevin
• Application Number:
  US10/229,788
• Publication Number:
  US 20040042179A1
• Time in Patent Office: Days
• US Class Current: 361/719
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

A heatsink for a printed circuit board (PCB) overlies most or all of the board. It is clamped tightly to the board with its board-facing surface in close proximity to the heat-generating components on the board. A pliant, thermally-conductive dielectric layer is sandwiched between the PCB and the facing surface of the heatsink. Lands at various heights are formed on the heatsink surface facing the PCB to be in good heat-conducting proximity to the surfaces of heat-generating circuit components of various heights on the PCB.

Claims

1. A multilayer printed circuit board and heatsink combination comprising:

(a) a multilayer printed circuit board having heat generating components on at least one face thereof,

(b) a heatsink overlying the at least one face of the board and the heat-generating components thereon,

(c) the heatsink having a surface conforming in part in contour to the heat-generating components on the board so as to fit on and around these components,

(d) a heat conducting dielectric layer sandwiched between and in heat-conducting contact with the heatsink and the board and its heat-generating components, and

(e) a plurality of connector clips securing the heatsink to the board.

2. The multilayer printed circuit board and heatsink according to claim 1, wherein the heatsink is substantially coextensive with the multilayer printed circuit board.

3. The multilayer printed circuit board and heatsink according to claim 2, wherein the heatsink has a second, exterior surface that is planar across a major portion of its area.

4. The multilayer printed circuit board and heatsink according to claim 2, wherein the heatsink has a second exterior surface of surface area-increasing features.

5. The multilayer printed circuit board and heatsink according to claim 2, wherein the clips are resilient metal clips dimensioned to grasp and hold together the board and the heatsink at their edges.

6. The multilayer printed circuit board and heatsink according to claim 5, wherein the board and the heatsink have aligned recesses into which the clips fit.

7. The multilayer printed circuit board and heatsink according to claim 1, wherein the board has at least one magnetic, the magnetic having a core penetrating multiple layers of the board and having an exterior portion with a surface external of the multiple layers of the board, the heatsink and intermediate dielectric layer being held tightly to the exterior surface of the core in heat conducting relation to the core.

8. The multilayer printed circuit board and heatsink according to claim 7, wherein the board is a power circuit, a plurality of conductive power-supply pins projecting from a second face of the board opposite the at least one face and adapted to connect to a further printed circuit board.

9. The multilayer printed circuit board and heatsink according to claim 8, further comprising a plurality of conductive signal-conducting pins projecting from the second face of the board and adapted to connect to the further printed circuit board.

10. A multilayer printed circuit board and heatsink combination comprising:

(a) a multilayer printed circuit board;

(b) a power circuit carried on at least one surface of the board;

(c) magnetics having cores penetrating the board and buried windings on interior surfaces of layers of the multilayer board;

(d) heat-generating electronic components on the at least one surface of the board;

(e) a heatsink overlying the cores and the heat-generating electronic components on the at least one surface of the board;

(f) a series of lands of varying heights adapted to be closely proximate the cores and heat-generating electronic components upon the heatsink being secured to the board;

(g) a thermally conductive, pliant, dielectric layer sandwiched between the board and the heatsink in contact with the cores and the heat-generating electronic components on the at least one surface of the board and the lands on the heatsink; and

(h) means for securing the heatsink to the board.

11. The multilayer printed circuit board and heatsink combination of claim 10, wherein the means for securing the heatsink to the board comprises a plurality of resilient metal clamps engaging the board and the heatsink at edges thereof.

12. A heatsink for a printed circuit board having heat-generating components mounted on at least one face;

the heatsink comprising a plate of heat-conductive material having a first surface contoured to accept into recesses formed therein heat-generating components on the board in heat-conducting association with the heatsink.

13. The heatsink according to claim 12, wherein the plate is substantially the same width and length as the board for which the heatsink is intended to be used.

14. The heatsink according to claim 13, wherein the heatsink has edge portions protruding from the first surface to engage the board at edges thereof, at least partially enclosing the components on the at least one face of the board.

15. The heatsink according to claim 13, wherein the plate has a substantially flat second surface.

16. The heatsink according to claim 13, wherein the plate has a second surface with surface area-increasing protrusions formed thereon.

17. The heatsink according to claim 13, wherein the plate has clamp-receiving recesses formed at edges thereof to receive clamps clamping the plate to the board.

18. The heatsink according to claim 14, wherein at least a plurality of areas on the first surface located for alignment with heat-generating components on the board have variations in height that bring them closely proximate to surfaces of the heat-generating components when the heatsink is secured to the board.