Surface micro-planarization for enhanced optical efficiency and pixel performance in SLM devices

• US 20040043552A1
• Filed: 09/02/2003
• Published: 03/04/2004
• Est. Priority Date: 12/15/2000
• Status: Active Grant

• Current Assignee: David L. Gillespie, James C. Baker, Mark H. Strumpell
• Original Assignee: David L. Gillespie, James C. Baker, Mark H. Strumpell
• Inventors: Baker, James C., Strumpell, Mark H., Gillespie, David L.
• Granted Patent: US 6,908,778 B2
• Time in Patent Office: Days
• US Class Current: 438/200
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

A method for enhancing the optical performance of a reflective spatial light modulator by micro-planarizing surfaces within the SLM, such as the reflective surface of each pixel, by gas-cluster-ion-beam bombardment.

Claims

1. A method of fabricating a reflective spatial light modulator, said method comprising:

providing a semiconductor substrate supporting a metal layer of a spatial light modulator has been formed;

smoothing a surface of said metal layer using gas cluster ion beam bombardment; and

completing said spatial light modulator.

2. The method of claim 1, said providing step comprising:

providing a semiconductor substrate supporting a metal layer of a liquid crystal display has been formed.

3. The method of claim 1, said providing step comprising:

providing a semiconductor substrate supporting a metal layer of a micromirror device has been formed.

4. The method of claim 1, said providing step comprising:

providing a semiconductor substrate supporting a metal layer of a micromirror device has been formed, the metal layer forming landing pads.

5. The method of claim 1, said providing step comprising providing a semiconductor substrate supporting a metal layer of a micromirror device has been formed, the metal layer forming landing pads, said method comprising:

providing a semiconductor substrate supporting a metal layer of a micromirror device has been formed, the metal layer forming a mirror.

6. The method of claim 1, said providing step comprising:

providing a semiconductor substrate supporting a metal layer of a micromirror device has been formed, the metal layer forming a mirror.