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Device for sintering, removing material and/or labeling by means of electromagnetically bundled radiation

  • US 20040045941A1
  • Filed: 09/22/2003
  • Published: 03/11/2004
  • Est. Priority Date: 10/30/2000
  • Status: Abandoned Application
First Claim
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1. Device for sintering, ablation and/or labeling by means of electromagnetically bundled radiation, especially laser sintering machines and/or laser surface processing machines, with a construction space (3) accommodated in a machine housing (2), in or above which are arranged a light-conducting device, in particular a scanner (4) into which is coupled the beam of a sinter energy source, a vertically displaceable work piece platform (7) and a material-supplying device with a coater (9) serving for feeding sintering material from a supply container (8) into the process area over the work piece platform (7), whereby the work piece platform (7) is removable from the construction space (3) as a changeable element, characterized in that the vertically displaceable work piece platform (7), the supply container (8) and the coater (9) are constructed as process platform/changeable units (10) capable of being removed, while remaining connected together, from the construction space (3), and that other process platform/changeable units (10) of the same or different design can be brought into the construction space (3) for carrying out similar or other processing operations.

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