Gate structures in nonvolatile memory devices having curved side walls formed using oxygen pathways and methods of forming same
First Claim
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1. A gate structure of a non-volatile integrated circuit memory device comprising:
- a thermal oxidation layer on a substrate beneath the gate structure and that defines a side wall of the gate structure;
an oxygen diffusion barrier layer on the side wall of the gate structure; and
a floating gate on the thermal oxidation layer having a curved side wall portion.
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Abstract
Gate structures of a non-volatile integrated circuit memory device can include a thermal oxidation layer on a substrate beneath the gate structure that defines a side wall of the gate structure. An oxygen diffusion barrier layer is on the side wall of the gate structure and a floating gate is on the thermal oxidation layer and has a curved side wall portion. Related methods are also discussed.
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Citations
35 Claims
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1. A gate structure of a non-volatile integrated circuit memory device comprising:
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a thermal oxidation layer on a substrate beneath the gate structure and that defines a side wall of the gate structure;
an oxygen diffusion barrier layer on the side wall of the gate structure; and
a floating gate on the thermal oxidation layer having a curved side wall portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of forming a gate structure of a non-volatile integrated circuit memory device comprising:
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forming a gate structure including a floating gate on an oxide layer on a substrate;
forming an oxygen diffusion barrier layer on a side wall of the gate structure above the oxide layer; and
forming a thermal oxidation layer from the oxide layer beneath the floating gate and on the floating gate between the oxygen diffusion barrier layer and the floating gate to define a curved side wall portion of the floating gate. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A method for fabricating a transistor of a nonvolatile memory device, comprising:
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forming a gate pattern on an integrated circuit substrate, the gate pattern including a gate oxide layer, a floating gate, an inter-gate dielectric pattern, and a control gate which are stacked in the order named;
forming a diffusion barrier layer on an entire surface of an integrated circuit substrate including the gate pattern;
anisotropically etching the diffusion barrier layer to form a diffusion barrier spacer over a lateral side of the gate pattern; and
thermally oxidizing an integrated circuit substrate including the diffusion barrier spacer. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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Specification