Plastic liquid crystal display device and method for manufacturing the same

• US 20040046923A1
• Filed: 05/09/2003
• Published: 03/11/2004
• Est. Priority Date: 09/11/2002
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Shiao, Po-Ling, Lai, Chih-Ming, Wu, Chien-Tsung, Shih, Hsi-Hsin, Liao, Chi-Chang, Wong, Yih-Jun, Chang, Hsien-Teng, Liu, Wen-Bing
• Granted Patent: US 6,922,227 B2
• Time in Patent Office: Days
• US Class Current: 349/158
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/133553 Reflecting elements associated to illuminating devices G02F1/133605

Abstract

A plastic liquid crystal display device and a fabrication method thereof. A plastic substrate having a plurality of bumps on at least one surface thereof is integrally molded. A glass transition temperature (T_g) of the plastic substrate is greater than 150° C. A melt flow index (MFI) of the plastic substrate is greater than 2. A conformal reflective film on the plastic substrate with the bumps is formed. An insulating substrate opposite the plastic plate is provided. A transparent electrode is formed on an inner surface of the insulating substrate. A liquid crystal layer is inserted between the plastic substrate and the insulating substrate.

Claims

1. A method for manufacturing a plastic liquid crystal display device, comprising the steps of:

integrally molding a plastic substrate having a plurality of bumps on at least one surface thereof, wherein the plastic substrate has heat-resistant and non-deforming reproducible properties; and

forming a conformal reflective film on the plastic substrate with the bumps.

2. The method according to claim 1, wherein a glass transition temperature (T_g) of the plastic substrate is greater than 150°

C.

3. The method according to claim 1, wherein a melt flow index (MFI) of the plastic substrate is greater than 2.

4. The method according to claim 1, wherein the plastic substrate is a PC (polycarbonate), PEN (polyethylenenaphthalate), PSF (polysulfone), PES (polyethersulfone), PAR (polyarylate), COP (cyclo olefin polymer), COC (cyclo olefin copolymer), PNB (polynorbornene), PI (polyimide), PET (polyetherimide), PPS (polyphenylenesulfide), PEEK (polyetheretherketone) or epoxy substrate.

5. The method according to claim 1, wherein the plastic substrate with the bumps is integrally molded by hot pressing, injection molding or extrusion embossing.

6. The method according to claim 1, wherein the reflective film is an aluminum (Al) or silver (Ag) film.

7. The method according to claim 1, further comprising the steps of:

providing an insulating substrate opposite the plastic substrate;

forming a transparent electrode on an inner surface of the insulating substrate; and

forming a liquid crystal layer inserted between the plastic substrate and the insulating substrate.

8. A method for manufacturing a plastic liquid crystal display device, comprising the steps of:

integrally molding a plastic substrate having a plurality of bumps on at least one surface thereof, wherein a glass transition temperature (T_g) of the plastic substrate is greater than 150°

C.; and

forming a conformal reflective film on the plastic substrate with the bumps.

9. The method according to claim 8, wherein a melt flow index (MFI) of the plastic substrate is greater than 2.

10. The method according to claim 8, wherein the plastic substrate is a PC (polycarbonate), PEN (polyethylenenaphthalate), PSF (polysulfone), PES (polyethersulfone), PAR (polyarylate), COP (cyclo olefin polymer), COC (cyclo olef in copolymer), PNB (polynorbornene), PI (polyimide), PEI (polyetherimide), PPS (polyphenylenesulfide), PEEK (polyetheretherketone) or epoxy substrate.

11. The method according to claim 8, wherein the plastic substrate with the bumps is integrally molded by hot pressing, injection molding or extrusion embossing.

12. The method according to claim 8, wherein the reflective film is an aluminum (Al) or silver (Ag) film.

13. The method according to claim 8, further comprising the steps of:

providing an insulating substrate opposite the plastic plate;

forming a transparent electrode on an inner surface of the insulating substrate; and

forming a liquid crystal layer inserted between the plastic substrate and the insulating substrate.

14. A plastic liquid crystal display device, comprising:

a plastic substrate having a plurality of bumps on at least one surface thereof, wherein the plastic substrate with the bumps is integrally molded and has heat-resistant and non-deforming reproducible properties;

a reflective film formed on the plastic substrate with the bumps;

a insulating substrate opposite the plastic substrate;

a transparent electrode formed on an inner surface of the insulating substrate; and

a liquid crystal layer inserted between the plastic substrate and the insulating substrate.

15. The plastic liquid crystal display device according to claim 14, wherein a glass transition temperature (T_g) of the plastic substrate is greater than 150°

C.

16. The plastic liquid crystal display device according to claim 14, wherein a melt flow index (MFI) of the plastic substrate is greater than 2.

17. The plastic liquid crystal display device according to claim 14, wherein the plastic substrate is a PC (polycarbonate), PEN (polyethylenenaphthalate), PSF (polysulfone), PES (polyethersulfone), PAR (polyarylate), COP (cyclo olefin polymer), COC (cyclo olefin copolymer), PNB (polynorbornene), PI (polyimide), PEI (polyetherimide) PPS (polyphenylenesulfide), PEEK (polyetheretherketone) or epoxy substrate.

18. The plastic liquid crystal display device according to claim 14, wherein the reflective film is an aluminum (Al) or silver (Ag) film.

19. The plastic liquid crystal display device according to claim 14, wherein the insulating substrate is a glass or plastic substrate.

20. The plastic liquid crystal display device according to claim 14, wherein the transparent electrode is an ITO (indium tin oxide) or IZO (indium zinc oxide) electrode.