Substrate for material to be exposed
First Claim
1. Substrate (1) with a reception surface (4) for a layer of material to be insolated by insolation light, characterised in that means forming a mirror (3) are arranged between said reception surface (4) and the layer of material to be insolated, these means forming a mirror (3) operating for the wavelength of the insolation light.
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Accused Products
Abstract
This invention relates to a substrate (1) with a reception surface (4) for a layer of material to be insolated by insolation light, wherein means forming a mirror (3) are arranged between said reception surface (4) and the layer of material to be insolated, these means forming a mirror (3) operating for the wavelength of the insolation light. This type of substrate may be used for making microelectronic or microtechnological devices, or biochips.
13 Citations
19 Claims
- 1. Substrate (1) with a reception surface (4) for a layer of material to be insolated by insolation light, characterised in that means forming a mirror (3) are arranged between said reception surface (4) and the layer of material to be insolated, these means forming a mirror (3) operating for the wavelength of the insolation light.
- 15. Process for making a microelectronic or microtechnological device or a biochip from a substrate, the process comprising the formation of a layer of material to be insolated on a reception surface of the substrate, the process also comprising, after insolation of said layer, subsequent steps of the realization of the microelectronic or microtechnological device or the biochip characterised in that the process comprises the formation of means forming a mirror at said reception surface, that function for the wavelength of the insolation light of the layer to be insolated, before formation of the layer of material to be insolated.
Specification