Storage apparatus, card type string apparatus, and electronic apparatus

• US 20040047210A1
• Filed: 08/14/2003
• Published: 03/11/2004
• Est. Priority Date: 03/26/1998
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Iwasaki, Hiroshi
• Granted Patent: US 7,019,392 B2
• Time in Patent Office: Days
• US Class Current: 365/202
• CPC Class Codes: G06K 19/07739 comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semiconductor device 14 disposed on the second surface of the wiring substrate 11 and having a connection terminal 14a connected to the flat type external connection terminal 12a, a molding resin 15 for coating the semiconductor device 14 on the second surface of the wiring substrate 11, a card type supporting frame 10a having a concave portion or a hole portion fitting the wiring substrate 11, the semiconductor device 14, and the molding resin 15 in such a manner that the flat type external connection terminal 12a is exposed to the first surface of the wiring substrate 11, and adhesive resin a adhering integrally the flat type external connection terminal 12a, the wiring substrate 11, the semiconductor device 14, the molding resin 15, and the card type supporting frame 10a. In addition, the storage apparatus 10 can be combined with a card type supporting means 21 that supports detachably with the flat type external connection terminal 12a exposed to one of the surfaces so as to be used as a card type storage apparatus 20 having bigger size.

Claims

1. A storage apparatus, comprising:

a wiring substrate having a first surface and a second surface;

a flat type external connection terminal disposed on the first surface of said wiring substrate;

a semiconductor device disposed on the second surface of said wiring substrate and having a connection terminal connected to said flat type external connection terminal; and

card type molding resin for coating said semiconductor device on the second surface of said wiring substrate with the same height as an exposed surface of said flat type external connection terminal.

2. The storage apparatus as set forth in claim 1,

wherein the area of a card type molding resin portion is the half or less of the area of said flat type external connection terminal.

3. The storage apparatus as set forth in claim 1,

wherein said semiconductor device is a serial access type semiconductor.

4. The storage apparatus as set forth in claim 1,

wherein said semiconductor device is a flash memory.

5. The storage apparatus as set forth in claim 1,

wherein said semiconductor device is a NAND type EEPROM or an AND type EEPROM.

6. The storage apparatus as set forth in claim 1,

wherein said flat type external connection terminal is composed of a conductor layer disposed on the first surface of said wiring substrate and having a slit for separating the first surface into a plurality of areas.

7. The storage apparatus as set forth in claim 6,

wherein a pattern of the slit connects any two points of the outer periphery of the conductor layer as a curved line or a bent line.

8. A storage apparatus, comprising:

a wiring substrate having a first surface and a second surface;

a flat type external connection terminal disposed on the first surface of said wiring substrate;

a semiconductor device disposed on the second surface of said wiring substrate and having a connection terminal connected to said flat type external connection terminal;

molding resin for coating said semiconductor device on the second surface of said wiring substrate;

a card type supporting frame having a concave portion or a hole portion formed on at least one surface of said card type supporting frame, the concave portion or the hole portion fitting said wiring substrate, said semiconductor device, and said molding resin in such a manner that said flat type external connection terminal is exposed to the first surface of said wiring substrate; and

adhesive resin filled in a supporting space formed among at least one of said flat type external connection terminal, said wiring substrate, said semiconductor device, said molding resin, and said card type supporting frame so as to integrally adhere said flat type external connection terminal, said wiring substrate, said semiconductor device, said molding resin, and said card type supporting frame.

9. The storage apparatus as set forth in claim 8,

wherein a molding resin free portion is formed at an edge portion of said flat type external connection terminal, a concave portion or a hole portion of said card type supporting frame being a shouldered concave portion or a shouldered hole portion having a first portion and a second portion, the first portion being fitted to the molding resin free portion of said flat type external connection terminal, the second portion being fitted to the molding resin portion of said flat type external connection terminal.

10. The storage apparatus as set forth in claim 8,

wherein the area of said card type supporting frame is the half or less of the area of said flat type external connection terminal.

11. The storage apparatus as set forth in claim 8,

wherein said semiconductor device is a serial access type semiconductor.

12. The storage apparatus as set forth in claim 8,

wherein said semiconductor device is a flash memory.

13. The storage apparatus as set forth in claim 8,

wherein said semiconductor-device is a NAND type EEPROM or an AND type EEPROM.

14. The storage apparatus as set forth in claim 8,

wherein said flat type external connection terminal is composed of a conductor layer disposed on the first surface of said wiring substrate and having a slit for separating the first surface into a plurality of areas.

15. The storage apparatus as set forth in claim 14,

wherein a pattern of the slit connects any two points of the outer periphery of the conductor layer as a curved line or a bent line.

16. A card type storage apparatus, comprising:

a storage apparatus having;

a wiring substrate having a first surface and a second surface,

a flat type external connection terminal disposed on the first surface of said wiring substrate,

a semiconductor device disposed on the second surface of said wiring substrate and having a connection terminal connected to said flat type external connection terminal, and

card type molding resin for coating said semiconductor device on the second surface of said wiring substrate with the same height as an exposed surface of said flat type external connection terminal; and

card type supporting means having a first surface and for detachably supporting said storage apparatus in such a manner that said flat type external connection terminal is exposed to the first surface of said card type supporting means.

17. The card type storage apparatus as set forth in claim 16,

wherein said supporting means has a concave portion with a shoulder corresponding to a card type molding resin portion disposed on a first surface of said supporting means.

18. The card type storage apparatus as set forth in claim 17,

wherein said supporting means has a concave portion and a slit formed on a first surface thereof, the card type supporting frame being inserted into the concave portion, the slit being formed on both edge surfaces of the concave portion along the insertion direction of the card type molding resin so that the card type molding resin is fitted to said supporting means.

19. The card type storage apparatus as set forth in claim 17,

wherein said supporting means has a tapered overhang portion for nipping the card type molding resin portion, the tapered overhang portion being disposed on both edge surfaces of the concave portion along the insertion direction.

20. The card type storage apparatus as set forth in claim 17,

wherein a bottom plate of the concave portion is composed of a metal plate.

21. The card type storage apparatus as set forth in claim 17, further comprising:

securing means for securing said storage apparatus supported by said supporting means.

22. The card type storage apparatus as set forth in claim 17,

wherein the supporting means is composed of a first portion and a second portion, the first portion surrounding the storage apparatus, the second portion being detachably connected to the first portion.

23. The card type storage apparatus as set forth in claim 16,

wherein said supporting means is flexible.

24. A card type storage apparatus, comprising:

a storage apparatus having;

a wiring substrate having a first surface and a second surface,

a flat type external connection terminal disposed on the first surface of said wiring substrate,

a semiconductor device disposed on the second surface of said wiring substrate and having a connection terminal connected to said flat type external connection terminal,

molding resin for coating said semiconductor device on the second surface of said wiring substrate,

a card type supporting frame having a concave portion or a hole portion formed on at least one surface of said card type supporting frame, the concave portion or the hole portion fitting said wiring substrate, said semiconductor device, and said molding resin in such a manner that said flat type external connection terminal is exposed to the first surface of said wiring substrate, and

adhesive resin filled between at least one of said flat type external connection terminal, said wiring substrate, said semiconductor device and said molding resin, and said card type supporting frame so as to integrally adhere said flat type external connection terminal; and

card type supporting means having a first surface and for detachably supporting said storage apparatus in such a manner that said flat type external connection terminal is exposed to the first surface of said card type supporting means.

25. The card type storage apparatus as set forth in claim 24,

wherein said supporting means has a concave portion with a shoulder corresponding to a card type supporting frame disposed on a first surface of said supporting means.

26. The card type storage apparatus as set forth in claim 25,

wherein said supporting means has a concave portion and a slit formed on a first surface thereof, the card type supporting frame being inserted into the concave portion, the slit being formed on both edge surfaces of the concave portion along the insertion direction of the card type supporting frame so that the card type supporting frame is fitted to said supporting means.

27. The card type storage apparatus as set forth in claim 25,

wherein said supporting means has a tapered overhang portion for nipping the card type supporting frame, the tapered overhang portion being disposed on both edge surfaces of the concave portion along the insertion direction.

28. The card type storage apparatus as set forth in claim 24,

wherein a bottom plate of the concave portion is composed of a metal plate.

29. The card type storage apparatus as set forth in claim 25, further comprising:

securing means for securing said storage apparatus supported by said supporting means.

30. The card type storage apparatus as set forth in claim 25,

wherein the supporting means is composed of a first portion and a second portion, the first portion surrounding the storage apparatus, the second portion being detachably connected to the first portion.

31. The card type storage apparatus as set forth in claim 24,

wherein said supporting means is flexible.

32. An electronic apparatus, comprising:

a storage apparatus having;

a wiring substrate having a first surface and a second surface,

a flat type external connection terminal disposed on the first surface of said wiring substrate,

a semiconductor device disposed on the second surface of said wiring substrate and having a connection terminal connected to said flat type external connection terminal, and

a card type molding resin layer for coating said semiconductor device on the second surface of said wiring substrate with the same height as an exposed surface of said flat type external connection terminal;

supporting means for supporting said storage apparatus;

a connection electrode that is contacted to said flat type connection terminal when said storage apparatus is supported by said supporting means; and

a driving circuit for accessing said semiconductor device through said connection electrode and said flat type external connection terminal.

33. The electronic apparatus as set forth in claim 32,

wherein said driving circuit serially accesses said semiconductor device.

34. An electronic apparatus, comprising:

a wiring substrate having a first surface and a second surface,

a flat type external connection terminal disposed on the first surface of said wiring substrate,

a semiconductor device disposed on the second surface of said wiring substrate and having a connection terminal connected to said flat type external connection terminal,

molding resin for coating said semiconductor device on the second surface of said wiring substrate,

a card type supporting frame having a concave portion or a hole portion formed on at least one surface of said card type supporting frame, the concave portion or the hole portion fitting said wiring substrate, said semiconductor device, and said molding resin in such a manner that said flat type external connection terminal is exposed to the first surface of said wiring substrate, and

adhesive resin filled in a supporting space formed among said flat type external connection terminal, said wiring substrate, said semiconductor device, said molding resin, and said card type supporting frame so as to integrally adhere said flat type external connection terminal, said wiring substrate, said semiconductor device, said molding resin, and said card type supporting frame;

supporting means for supporting said storage apparatus;

a connection electrode that is contacted to said flat type connection terminal when said storage apparatus is supported by said supporting means; and

a driving circuit for accessing said semiconductor device through said connection electrode and said flat type external connection terminal.

35. The electronic apparatus as set forth in claim 34,

wherein said driving circuit serially accesses said semiconductor device.