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Plasma processing apparatus and plasma processing method

  • US 20040050495A1
  • Filed: 02/12/2003
  • Published: 03/18/2004
  • Est. Priority Date: 09/13/2002
  • Status: Abandoned Application
First Claim
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1. A plasma processing apparatus comprising:

  • a processing chamber to which is connected an evacuator for decompressing the inner space of the processing chamber;

    a gas feeding apparatus for feeding gas into the processing chamber;

    a wafer electrode on which is mounted an object to be processed;

    an antenna electrode for generating plasma which is disposed so as to oppose to the wafer electrode;

    a plasma-generating high frequency power supply connected to the antenna electrode;

    a first high frequency power supply connected to the wafer electrode;

    a second high frequency power supply connected to the antenna electrode; and

    a phase control means for controlling a phase difference of two high frequencies having the same frequency and applied from the first high frequency power supply and the second high frequency power supply, respectively.

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