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Encapsulation for organic devices

  • US 20040051449A1
  • Filed: 09/12/2002
  • Published: 03/18/2004
  • Est. Priority Date: 09/12/2002
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a substrate having an active region defined thereon, the active region comprising an active component, a cap bonding region surrounding the active region, and a getter region between the active region and the cap bonding region;

    a cap bonded to the substrate in the cap bonding region to encapsulate the device; and

    a getter ring located in an area corresponding the getter region.

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