Integrated fluid cooling system for electronic components

• US 20040052049A1
• Filed: 11/07/2002
• Published: 03/18/2004
• Est. Priority Date: 09/13/2002
• Status: Active Grant

• Current Assignee: Bo Jiu Wu, Jia J.U. Zhang, Zhong Ming Wu
• Original Assignee: Bo Jiu Wu, Jia J.U. Zhang, Zhong Ming Wu
• Inventors: Wu, Bo Jiu, Wu, Zhong Ming, Zhang, Jia Ju
• Granted Patent: US 6,894,899 B2
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 2015/0291 comprising internal rotor means, e.g. turbine driven by the working fluid
• CPC Class Codes: F28D 2021/0031 Radiators for recooling a coolant of cooling systems
• CPC Class Codes: F28F 2250/08 Fluid driving means, e.g. pumps, fans
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An improved cooling system designed for electronic components such as a central processing unit of a computer with an integrated unit comprising a radiation housing, an absorption housing having a coolant store unit, an absorption layer between the coolant store unit and the electronic component and a circulation generation unit which causes a coolant to flow from the coolant store unit to the absorption layer and back to the coolant store unit through a conduit.

Claims

1. An improved cooling system designed for an electronic component comprising:

(a) a coolant; and

(b) an integrated unit comprising;

(i) absorption housing having a coolant store unit; and

(ii) radiation housing having a plurality of radiation sheets;

(iii) an absorption layer between the coolant store unit and the electronic component; and

(iv) a circulation generation unit having a brushless DC motor, a motor stator, a top cover of the coolant store unit to prevent from leakage of the coolant, rotor and an impeller which causes the coolant to flow from the coolant store unit to the absorption housing and back to the coolant store unit through a conduit.

2. The cooling system of claim 1 wherein the electronic component is selected from the group consisting of a Central Processing Unit (CPU), super power tube, integrated chip (IC) and internet networking master board;

and wherein the coolant is a fluid selected from a group consisting of gas, liquid or mixtures thereof.

3. The cooling system of claim 2 wherein the liquid is selected from a group consisting of water (H₂O), ammonia (NH₃), transformer oil, fluorinated organic compounds, ethylene glycol or mixtures thereof.

4. The cooling system of claim 1 wherein the absorption layer having a high heat conductivity is selected from a group consisting of bronze, copper (Cu), red copper tube, aluminum (Al), and alloys thereof;

and wherein said absorption layer forms a chassis of the cooling system and is in contact with the electronic component and the coolant.

5. The cooling system of claim 4 wherein the absorption layer is a mixture of plastic and copper powder.

6. The cooling system of claim 4 wherein the conduit circumnavigates in the integrated unit and connects an inlet and an outlet of the coolant storage unit so that the liquid flowing out of the coolant and the liquid flowing into the coolant storage unit is in the same direction as the rotation of an impeller.

7. The cooling system of claim 1 wherein the absorption layer further comprises at least one groove bent in the same angle as the rotation.

8. The cooling system of claim 5 wherein the circulation generation unit of has a comparable power supply as the electronic component.

9. The cooling system of claim 1 wherein the absorption housing further comprises an absorption layer which forms the base of the coolant storage unit and the CPU and wherein the conduit is connected to the coolant storage unit at the outlet and the inlet.

10. The cooling system of claim 8 wherein the circulation generation unit further comprises a brushless DC motor, an impeller, a rotor, a top cover of the coolant storage unit and a motor stator.

11. The cooling system of claim 9 wherein the impeller further comprises an axis and at least one blade having one-third of the bottom part slightly bent at an angle towards the direction of rotation making it a shape of an arc to enhance the heat transfer process by creating a lifting force for the coolant at the bottom part of the coolant storage unit.

12. The cooling system of claim 9 wherein the radiation housing further comprises a fan.

13. The cooling system of claim 1 wherein the top cover is non-magnetic.

14. The cooling system of claim 10 wherein the top cover is non-magnetic.

15. An electronic device comprising the improved cooling system of claim 1.

16. The cooling system of claim 3 wherein the absorption layer having a high heat conductivity is selected from a group consisting of bronze, copper (Cu), red copper tube, aluminum (Al), and alloys thereof;

and wherein said absorption layer forms a chassis of the cooling system and is in contact with the electronic component and the coolant.