Cooling device, electronic equipment device, and method of manufacturing cooling device
First Claim
1. A cooler comprising:
- first board member having a cavity portion formed on a surface thereof, said cavity corresponding to a part of a heat pipe excluding at least a wick part therefrom;
second board member having at least a groove for the wick part formed on a surface thereof, said second board member being made from material having higher thermal conductivity than said first board member has, the surface of said second board member being adhered to the first board member; and
third board member incorporating said second board member through a surface thereof, the surface of said third board member being adhered to the first board member.
1 Assignment
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Accused Products
Abstract
This invention provides a cooler having an excellent cooling performance, which is capable of being downsized and low-profiled, an electronic apparatus and a method for fabricating the cooler. The cooler (1) comprises lower board member (10) and upper complex board members. The lower board member (10) is made from plastic material and has a cavity portion (11) for allowing water or vapor to be circulated therein. The upper complex board members comprise board member (20) for a condenser part, upper board member (30), and board member (40) for a wick part. The board members (20) and (40) for the condenser part and the wick part, respectively, are made from metallic material having higher thermal conductivity such as copper and nickel. Each of the members has a groove for allowing them to be served as the condenser and the wick. The upper board member (30) includes an opening (32) or (34) for allowing the board member (20) or (40) for the condenser part or the wick part to be incorporated, and a hollow (31) for heat insulation.
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Citations
11 Claims
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1. A cooler comprising:
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first board member having a cavity portion formed on a surface thereof, said cavity corresponding to a part of a heat pipe excluding at least a wick part therefrom;
second board member having at least a groove for the wick part formed on a surface thereof, said second board member being made from material having higher thermal conductivity than said first board member has, the surface of said second board member being adhered to the first board member; and
third board member incorporating said second board member through a surface thereof, the surface of said third board member being adhered to the first board member. - View Dependent Claims (2, 3, 4, 5)
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6. A cooler comprising:
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first board device including at least a wick part of a heat pipe;
second board device including at least a condenser part of the heat pipe, said second board device being physically separated from said first board device; and
flexible board member intervening between said first and second board devices, said flexible board member including a passage for interconnecting the wick part and the condenser part.
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7. An electronic apparatus comprising a slot portion into which a card-typed storage medium having a flush memory and a driver is detachably inserted, or a driver provided with the device side or a driver equipped with a portion separated from the device,
said electronic apparatus further comprising a cooler for transferring heat generated from the driver, said cooler including: -
first board member having a cavity portion formed on a surface thereof, said cavity portion corresponding to a part of a heat pipe excluding at least a wick part therefrom;
second board member having at least a groove for the wick part formed on a surface thereof, said second board member being made from material having higher thermal conductivity than said first board member has, the surface of said second board member being adhered to the first board member; and
third board member incorporating said second board member through a surface thereof, the surface of said third board member being adhered to the first board member.
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8. A method for fabricating a cooler comprising the steps of:
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forming first board member having a cavity portion on a surface thereof, said cavity corresponding to a part of a heat pipe excluding at least a wick part therefrom;
forming second board member having at least a groove for the wick part on a surface thereof, said second board member being made from material having higher thermal conductivity than said first board member has;
incorporating said second board member to third board member through a surface thereof; and
adhering a surface of the third board member to a surface of the first board member. - View Dependent Claims (9, 10, 11)
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Specification