Method for coating substrates and mask holder

• US 20040052942A1
• Filed: 10/06/2003
• Published: 03/18/2004
• Est. Priority Date: 12/15/2000
• Status: Abandoned Application

• Current Assignee: Carl Zeiss AG (Carl-Zeiss-Stiftung)
• Original Assignee: Carl Zeiss AG (Carl-Zeiss-Stiftung)
• Inventors: Kessels, Marcus Jozef Henricus, Bruineman, Caspar, Yakshin, Andrey E, Maas, Edward Lambertus Gerardus, Louis, Eric, Bijkerk, Frederik
• Application Number:
  US10/450,732
• Publication Number:
  US 20040052942A1
• Time in Patent Office: Days
• US Class Current: 427/248.1
• CPC Class Codes: C23C 14/044 using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
• CPC Class Codes: C23C 16/042 using masks

Abstract

When coating substrates it is frequently desired that the layer thickness should be a certain function of the position on the substrate to be coated. To control the layer thickness a mask is conventionally arranged between the coating particle source and the substrate. This leads to undesirable shadow effects. In addition, is has so far only been possible to obtain rotationally symmetrical thickness distributions. It is now proposed that masks should be used having apertures aligned according to a regular grid on the mask surface. Such a mask with a mask holder comprising a base frame (2), an intermediate frame (3) and a mask frame (4) which are joined one to the other by means of double hinges (5a, a′, b, b′), is moved arbitrarily in the mask plane. By this means arbitrary thickness distributions can be achieved when coating substrates at reasonable cost.

Claims

1. A method for coating substrates by means of physical vapour deposition (PVD) and/or chemical vapour deposition (CVD) having any coating thickness distributions, especially for manufacturing optical single-layer or multi-layer systems for the visible, extreme ultraviolet and x-ray wavelength ranges, in which between at least one substrate to be coated and at least one particle source at least one mask is provided, characterised in that

a mask with i>

1 apertures is used, whose position on the mask surface is described by the family of vectors p_i=n_i1v₁+n_i2v₂ and whose area is a function of the position, wherein the family of vectors depends on the desired thickness distribution, i is a natural number, n_i1 and n_i2 are integers and v₁, v₂ and p_i are vectors;

relative motion is accomplished between mask and/or substrate and/or particle source.

2. Method according to claim 1 characterized by the steps:

a) a mask having uniform aperture sizes is used and, the substrate is coated, whereby a relative motion in two directions is performed,

b) the thickness distribution of the coating is measured and.

c) the apertures are modified to increase or decrease the transmission of the mask locally in order to achieve the desired thickness distribution without shadows.

3. Method according to claim 2 characterized in that in step c the area A of the apertures is modified according to the following formula A≈

A₀(s²−

NU)(h_m/h_s)² where NU is the non-uniformity of the thickness of the coating, s equals the distance from the center of the substrate in mm, h_m equals the distance from the mask to the source and h_s equals the distance from the substrate to the source and A₀ is the area of the center aperture.

4. Method according to one of the claims 1 to 3 characterized in that a mask is used that has apertures with diameters in the range of 0.01 to 10 mm whereby the distances between the centres of the apertures is in the range of 0.02 to 11 mm.

5. Method according to one of claims 1 to 4 characterized in that a mask is used that has apertures sizes that increase as one gets farther from the center.

6. The method according to one of claims 1 to 5, characterised in that a mask is used where the area of the apertures is selected as a function of the spatial distribution of the particles in the particle flow and the desired coating thickness distribution.

7. The method according to one of claims 1 to 6, characterised in that the relative motion is accomplished such that it can be described by a step function.

8. The method according to one of claims 1 to 6, characterised in that the relative motion is accomplished at a constant speed.

9. The method according to one of claims 1 to 6, characterised in that the relative motion is accomplished such that it has a rotational component, especially about an axis of symmetry of the substrate and/or the mask and/or the particle source.

10. The method according to one of claims 1 to 6, characterised in that the relative motion is accomplished such that it can be described by a periodic function.

11. The method according to claim 10, characterised in that the amplitude of the relative motion is selected as a function of the position and area of the mask apertures.

12. The method according to claim 10, characterised in that the amplitude of the relative motion is a function of the length of the vector v₁ and/or V₂.

13. The method according to one of claims 10 to 12, characterised in that the relative motion is accomplished such that it can be described by a sine function.

14. The method according to one of claims 10 to 12, characterised in that the relative motion is accomplished such that it can be described by a periodically repeating triangular function.

15. The method according to one of claims 10 to 12, characterised in that the relative motion is accomplished such that it can be described by a saw-tooth function.

16. The method according to one of claims 7 to 15, characterised in that the relative motion is accomplished such that it can be described as the superposition of said motions.

17. A mask holder especially for use in methods according to claims 1 to 16 with a base frame (2), an intermediate frame (3) and a mask frame (4) and at least two double hinges (5a, 5a′

, 5b, 5b′

), wherein at least one (5b, 5b′

) of the at least two double hinges (5a, 5a′

, 5b, 5b′

) joins the base frame (2) to the intermediate frame (3) and at least one (5a, 5a′

) of the at least two double hinges (5a, 5a′

, 5b, 5b′

) joins the mask frame (4) to the intermediate frame (3).

18. The mask holder according to claim 17, characterised in that the double hinges (5a, 5a′

, 5b, 5b′

) are attached such that the movement of the intermediate frame (3) relative to the base frame (2) in the mask plane allowed by the double hinges (5a, 5a′

, 5b, 5b′

) is perpendicular to that of the mask frame (4) relative to the intermediate frame (3).

19. The mask holder according to claim 17 or 18, characterised in that it has a total of four double hinges (5a, 5a′

, 5b, 5b′

) of which respectively two are arranged on opposite sides of the mask holder (1).