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Substrate slot formation

  • US 20040055145A1
  • Filed: 09/12/2003
  • Published: 03/25/2004
  • Est. Priority Date: 01/31/2002
  • Status: Active Grant
First Claim
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1. A method comprising:

  • making a cut into a first surface of a substrate using a cutting disk having a generally planar surface that is oriented generally perpendicular to the first surface;

    first directing abrasive particles toward a first portion of a second generally opposite surface of the substrate to remove substrate material; and

    , after said first directing, second directing abrasive particles toward a second different portion of the second surface of the substrate to remove additional substrate material, wherein said first directing and said second directing, in combination with said making a cut, form a slot.

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