Surface-mounting type electronic circuit unit having no melting of solder attaching electric part thereto

• US 20040055782A1
• Filed: 09/17/2003
• Published: 03/25/2004
• Est. Priority Date: 09/24/2002
• Status: Abandoned Application

• Current Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Original Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Inventors: Yamamoto, Yukimasa
• Application Number:
  US10/664,353
• Publication Number:
  US 20040055782A1
• Time in Patent Office: Days
• US Class Current: 174/250
• CPC Class Codes: H05K 1/0201 Thermal arrangements, e.g. for cooling, heating or preventing overheating
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/062 Means for thermal insulation, e.g. for protection of parts
• CPC Class Codes: H05K 2201/09181 Notches in edge pads
• CPC Class Codes: H05K 2201/09263 Meander
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/403 Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

The present invention provides a surface-mounting type electronic circuit unit having no melting of solder attaching an electric part thereto and having high reliability. Therefore, the surface-mounting type electronic circuit unit of the present invention has a side electrode arranged on a side face; a circuit substrate having a wiring pattern arranged on an upper face in a state connected to this side electrode; and an electric part connected to the wiring pattern by soldering. A connecting conductor of the wiring pattern connecting the electric part arranged in a position very near the side electrode is formed in a bent state. Therefore, the connecting conductor between the side electrode and the electric part can be lengthened. Accordingly, solder heat due to the soldering of an electrically conductive pattern and the side electrode and the heat of a flux fall on the electric part side, and an influence on the solder attaching the electric part thereto is small so that this solder is not melted and the surface-mounting type electronic circuit unit of high reliability is obtained.

Claims

1. A surface-mounting type electronic circuit unit comprising:

a side electrode arranged on a side face;

a circuit substrate having a wiring pattern arranged on an upper face in a state connected to this side electrode; and

an electric part connected to said wiring pattern by soldering;

wherein said wiring pattern has a connecting conductor electrically connecting said side electrode and said electric part, and said connecting conductor connecting said electric part arranged in a position very near said side electrode is formed in a bent state.

2. The surface-mounting type electronic circuit unit according to claim 1, wherein said connecting conductor is formed in the bent state of a zigzag shape.

3. A surface-mounting type electronic circuit unit comprising:

a side electrode arranged on a side face;

a circuit substrate having a wiring pattern arranged on an upper face in a state connected to this side electrode; and

an electric part connected to said wiring pattern by soldering;

wherein said wiring pattern has a connecting conductor electrically connecting said side electrode and said electric part, and a silk layer is formed on said connecting conductor connecting said electric part arranged in a position very near said side electrode so as to cross this connecting conductor.

4. The surface-mounting type electronic circuit unit according to claim 3, wherein said connecting conductor is formed in a straight line shape.

5. The surface-mounting type electronic circuit unit according to claim 3, wherein said connecting conductor is formed in a bent state.

6. The surface-mounting type electronic circuit unit according to claim 5, wherein said connecting conductor is formed in the bent state of a zigzag shape.