Wafer backside electrical contact for electrochemical deposition and electrochemical mechanical polishing
First Claim
1. An electrochemical plating cell, comprising:
- a plating solution reservoir configured to contain a volume of an electrochemical plating solution;
a substrate support member positioned above the plating solution reservoir, the substrate support member being configured to electrically engage a non-production side of a substrate secured thereto, the substrate support member comprising;
a substrate support surface having at least one vacuum channel formed therein, the substrate support surface facing the plating solution reservoir;
a plurality of electrical contact pins extending from the substrate support surface and being positioned to engage a perimeter of the non-production side of the substrate secured thereto; and
at least one annular seal positioned on the substrate support surface radially outward of the plurality of electrical contact pins, the at least one annular seal being configured to prevent flow of the electrochemical plating solution to the plurality of electrical contact pins; and
a power supply in electrical communication with an anode positioned in the electrochemical plating solution and the plurality of electrical contact pins.
3 Assignments
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Accused Products
Abstract
A method and apparatus for electrochemically plating on a production surface of a substrate are provided. The apparatus generally includes a plating cell having a plating solution reservoir configured to contain a volume of an electrochemical plating solution, and a substrate support member positioned above the plating solution reservoir, the substrate support member being configured to electrically engage a non-production side of a substrate secured thereto. The substrate support member generally includes a substrate support surface having at least one vacuum channel formed therein, a plurality of electrical contact pins extending from the substrate support surface and being positioned to engage a perimeter of the non-production side of the substrate secured thereto, and at least one annular seal positioned on the substrate support surface radially outward of the plurality of electrical contact pins, the at least one annular seal being configured to prevent flow of the electrochemical plating solution to the plurality of electrical contact pins. The plating cell further includes a power supply in electrical communication with an anode positioned in the electrochemical plating solution and the plurality of electrical contact pins.
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Citations
23 Claims
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1. An electrochemical plating cell, comprising:
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a plating solution reservoir configured to contain a volume of an electrochemical plating solution;
a substrate support member positioned above the plating solution reservoir, the substrate support member being configured to electrically engage a non-production side of a substrate secured thereto, the substrate support member comprising;
a substrate support surface having at least one vacuum channel formed therein, the substrate support surface facing the plating solution reservoir;
a plurality of electrical contact pins extending from the substrate support surface and being positioned to engage a perimeter of the non-production side of the substrate secured thereto; and
at least one annular seal positioned on the substrate support surface radially outward of the plurality of electrical contact pins, the at least one annular seal being configured to prevent flow of the electrochemical plating solution to the plurality of electrical contact pins; and
a power supply in electrical communication with an anode positioned in the electrochemical plating solution and the plurality of electrical contact pins. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An apparatus for electrochemically plating metal onto a substrate, comprising:
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a substrate support member having a substrate support surface formed thereon, the substrate support member being configured vacuum chuck a non-production side of the substrate to the substrate support surface and electrically engage non-production side of the substrate;
plating bath positioned below the substrate support member, the plating bath being configured to contain an electrochemical plating solution and an anode therein; and
a head assembly in mechanical communication with the substrate support member, the head assembly being configured actuate the substrate support member in at least one of horizontally, vertically, pivotally, and rotationally to support the substrate in a face down configuration in the plating bath. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method for electrochemically plating metal onto a substrate, comprising:
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depositing a seed layer on a production surface of the substrate, the seed layer extending around a bevel edge of the substrate onto at least a portion of a non-production surface of the substrate;
vacuum chucking the non-production surface of the substrate to a substrate support member;
immersing the production surface of the substrate in an electrochemical plating solution having an anode positioned therein; and
providing an electrical plating bias between the production surface of the substrate and the anode via electrically connecting the portion of the seed layer that extends onto at least a portion of the non-production surface with a cathode terminal of a power supply and electrically connecting the anode with an anode terminal of a power supply. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23)
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Specification