SURFACE PROCESSING METHOD FOR A MOLDED METAL HOUSING

• US 20040056000A1
• Filed: 01/06/2003
• Published: 03/25/2004
• Est. Priority Date: 09/20/2002
• Status: Abandoned Application

• Current Assignee: Wistron Corporation
• Original Assignee: Wistron Corporation
• Inventors: Hong, C.Y., Tsai, Chu-Chia
• Application Number:
  US10/248,278
• Publication Number:
  US 20040056000A1
• Time in Patent Office: Days
• US Class Current: 216/100
• CPC Class Codes: B44C 1/221 using streams of abrasive particles
• CPC Class Codes: B44C 1/227 by etching
• CPC Class Codes: C23F 1/02 Local etching
• CPC Class Codes: C25D 11/02 Anodisation
• CPC Class Codes: H01L 21/4817 for containers, e.g. caps H01L21/4871 takes precedence

Abstract

A surface processing method for forming a predetermined pattern on a molded metal housing includes forming an isolation layer related to the predetermined pattern onto the surface of the molded metal housing and etching the surface of the molded metal sheet. The isolation layer is used for defining whether the surface of the molded metal sheet covered by the isolation layer is etched or not.

Claims

1. A surface processing method for forming a predetermined pattern on a metal housing, the metal housing being molded into a predetermined shape in advance, the surface processing method comprising following steps:

(a)covering a surface of the metal housing with an isolation layer corresponding to the predetermined pattern;

(b)soaking the metal housing in an etching solution for etching parts of the surface of the metal housing which are not covered by the isolation layer; and

(c)removing the isolation layer and the etching solution from the surface of the metal housing.

2. The surface processing method of claim 1 wherein the isolation layer is printing ink.

3. The surface processing method of claim 1 wherein step (a) comprises:

forming the isolation layer on the surface of the metal housing by a predetermined printing process.

4. The surface processing method of claim 3 wherein the predetermined printing process is a silk screen printing process.

5. The surface processing method of claim 3 wherein the predetermined printing process is a pad printing process.

6. The surface processing method of claim 1 wherein step (a) comprises:

spraying the isolation layer onto the surface of the metal housing.

7. The surface processing method of claim 1 wherein step (a) comprises:

printing the isolation layer on a surface of a transfer medium;

contacting the surface of the metal housing and the surface of the transfer medium which is printed by the isolation layer for transferring the isolation layer from the transfer medium to the surface of the metal housing; and

removing the transfer medium.

8. The surface processing method of claim 7 wherein the transfer medium is a plastic membrane.

9. The surface processing method of claim 1 wherein the etching solution is used for removing oxides of the metal housing.

10. The surface processing method of claim 1 wherein the etching solution comprises KOH and Na₃PO4.

11. The surface processing method of claim 1 further comprising:

performing a sandblasting process on the surface of the metal housing for smoothing the surface of the metal housing before starting step (a).

12. The surface processing method of claim 1 further comprising:

performing a sandblasting process on the surface of the metal housing for smoothing the surface of the metal housing after finishing step (c).

13. The surface processing method of claim 1 further comprising:

performing an anodizing process on the surface of the metal housing for forming a metal compound membrane to cover the surface of the metal housing after finishing step (c).

14. The surface processing method of claim 1 wherein the metal housing comprises aluminum alloys.

15. The surface processing method of claim 1 wherein the metal housing comprises magnesium alloys.