SOLID STATE GAMMA CAMERA MODULE AND INTEGRATED THERMAL MANAGEMENT METHOD THEREOF

• US 20040056205A1
• Filed: 04/25/2002
• Published: 03/25/2004
• Est. Priority Date: 04/25/2002
• Status: Active Grant

• Current Assignee: Siemens Medical Solutions USA Incorporated (Siemens AG)
• Original Assignee: Siemens Medical Solutions USA Incorporated (Siemens AG)
• Inventors: Dailey, George W., Caruba, James F.
• Granted Patent: US 6,921,904 B2
• Time in Patent Office: Days
• US Class Current: 250/370.15
• CPC Class Codes: G01T 1/2928 using solid state detectors

Abstract

A solid state gamma camera module and integrated thermal management method thereof includes a printed circuit board having a first thermal layer and a second thermal layer. The first thermal layer is thermally and/or electrically bonded to the second thermal layer. A semiconductor detector module having the temperature sensitive material electrically communicates with the second thermal layer. A plurality of the integrated circuits each having a bottom metal layer and wire bonds are electrically connected to the first thermal layer. A cover is electrically and thermally bonded to the first thermal layer and covers the plurality of integrated circuits. The first thermal layer extracts heat from the integrated circuits by direct interface to the bottom metal layer (or the second thermal layer), and the second thermal layer extracts heat from an integrated circuit (IC) interconnect. The IC interconnect can be through a wire bond, die bond, direct solder flip chip attachment or the like. Accordingly, heat generated by the integrated circuits is removed while heat flow to the temperature sensitive material is reduced.

Claims

1. A solid state gamma camera module for providing a low thermal resistance path between integrated circuits and a heat sink interface while reducing a heat conduction path to temperature sensitive material, comprising:

a printed circuit board having a first thermal layer and a second thermal layer, said first thermal layer being thermally and/or electrically bonded to said second thermal layer;

a semiconductor detector module having said temperature sensitive material operable to electrically communicate with said second thermal layer;

a plurality of said integrated circuits each having a bottom metal layer and wire bonds, said integrated circuits being electrically connected to said first thermal layer; and

covering means electrically and thermally bonded to said first thermal layer and operable to cover said plurality of integrated circuits,

wherein said first thermal layer extracts heat from said integrated circuits by direct interface to said bottom metal layer and said second thermal layer extracts heat from an integrated circuit interconnect.

2. The camera module of claim 1, wherein said temperature sensitive material is cadmium zinc telluride.

3. The camera module of claim 1, further comprising an insulating layer disposed between said detector module and said printed circuit board.

4. The camera module of claim 1, wherein said covering means comprises internal structuring means operable to provide a thermal interface point to said first thermal layer.

5. The camera module of claim 1, wherein said covering means and said printed circuit board form a thermal metal layer.

6. The camera module of claim 1, wherein said integrated circuit interconnect is through at least one of said wire bonds and die bonds.

7. A solid state gamma camera module for providing a low thermal resistance path between integrated circuits and a heat sink interface while reducing a heat conduction path to temperature sensitive material, comprising:

a printed circuit board having a first thermal layer and a second thermal layer, said first thermal layer being thermally and/or electrically bonded to said second thermal layer;

a semiconductor detector module having said temperature sensitive material operable to electrically connect with said second thermal layer;

a plurality of said integrated circuits being electrically connected to said first thermal layer; and

covering means electrically and thermally bonded to said first thermal layer and operable to cover said plurality of integrated circuits,

wherein said first thermal layer extracts heat from said integrated circuits through said second thermal layer and said second thermal layer extracts heat from an integrated circuit interconnect.

8. The camera module of claim 7, wherein said temperature sensitive material is cadmium zinc telluride.

9. The camera module of claim 7, wherein said integrated circuit interconnect is through a direct solder flip chip attachment.

10. The camera module of claim 7, wherein said second thermal layer serves as a thermal path to said first thermal layer.

11. The camera module of claim 7, wherein said integrated circuit interconnect is through external connecting terminals.

12. The camera module of claim 11, wherein said external connecting terminals are solder coats or solder balls.

13. An integrated thermal management method for providing a low thermal resistance path between integrated circuits and a heat sink interface while reducing a heat conduction path to temperature sensitive material, comprising the steps of:

providing a printed circuit board with a first thermal layer and a second thermal layer, said first thermal layer thermally and/or electrically bonded to said second thermal layer;

providing a semiconductor detector module with said temperature sensitive material operable to electrically communicate with said second thermal layer;

providing a plurality of said integrated circuits with a bottom metal layer and wire bonds, said integrated circuits being electrically connected to said first thermal layer; and

providing covering means electrically and thermally bonded to said first thermal layer, with said covering means covering said plurality of integrated circuits,

wherein said first thermal layer extracts heat from said integrated circuits by direct interface to said bottom metal layer and said second thermal layer extracts heat from an integrated circuit interconnect.

14. The method of claim 13, wherein said temperature sensitive material is cadmium zinc telluride.

15. The method of claim 13, further comprising the step of providing an insulating layer between said detector module and said printed circuit board.

16. The method of claim 13, wherein said covering means comprises internal structuring means operable to provide a thermal interface point to said first thermal layer.

17. The method of claim 13, wherein said covering means and said printed circuit board form a thermal metal layer.

18. The method of claim 13, wherein said integrated circuit interconnect is through said wire bonds.

19. An integrated thermal management method for providing a low thermal resistance path between integrated circuits and a heat sink interface while reducing a heat conduction path to temperature sensitive material, comprising the steps of:

providing a printed circuit board with a first thermal layer and a second thermal layer, said first thermal layer thermally and/or electrically bonded to said second thermal layer;

providing a semiconductor detector module with said temperature sensitive material operable to electrically communicate with said second thermal layer;

providing a plurality of said integrated circuits electrically connected to said first thermal layer; and

providing covering means electrically and thermally bonded to said first thermal layer, with said covering means covering said plurality of integrated circuits,

wherein said first thermal layer extracts heat from said integrated circuits through said second thermal layer and said second thermal layer extracts heat from an integrated circuit interconnect.

20. The method of claim 19, wherein said temperature sensitive material is cadmium zinc telluride.

21. The method of claim 19, wherein said integrated circuit interconnect is through a direct solder flip chip attachment.

22. The method of claim 19, wherein said second thermal layer serves as a thermal path to said first thermal layer.

23. The method of claim 19, wherein said integrated circuit interconnect is through external connecting terminals.

24. The method of claim 23, wherein said external connecting terminals are solder coats or solder balls.