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Semiconductor device, semiconductor package member, and semiconductor device manufacturing method

  • US 20040056341A1
  • Filed: 09/17/2003
  • Published: 03/25/2004
  • Est. Priority Date: 09/19/2002
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a wiring board;

    a semiconductor chip provided on said wiring board and having a pad electrically connected to a wiring on said wiring board; and

    a second semiconductor chip provided on said wiring board at a position facing a side of said semiconductor chip, having passive elements integrated therein, and having pads for external connection to which both ends of the passive elements are connected respectively and at least one of which is electrically connected to the wiring on said wiring board electrically connected to the pad of said semiconductor chip.

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