Stacked die module and techniques for forming a stacked die module
First Claim
1. A method of stacking semiconductor die comprising the acts of:
- a) picking up a first die having a topside and an underside with a die picking tool;
b) applying adhesive to the underside of the first die, thereby providing an adhesively coated underside of the first die; and
c) without releasing the first die from the die picking tool, picking up a second die having a topside and an underside by placing the adhesively coated underside of the first die against the topside of the second die, thereby forming a die stack.
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Accused Products
Abstract
A technique for forming die stacks. Specifically, a stacking tip is provided to facilitate the stacking of die in a desired configuration. A first die is picked up by the stacking tip. The first die is coated with an adhesive on the underside of the die. The first die is brought in contact with a second die via the stacking tip. The second die is coupled to the first die via the adhesive on the underside of the first die. The second die is coated with an adhesive coating on the underside of the die. The second die is then brought in contact with a third die via the stacking tip. The third die is coupled to the second die via the adhesive on the underside of the second die, and so forth. Die stacks are formed without being coupled to a substrate. The die stacks may be functionally and/or environmentally tested before attaching the die stack to a substrate.
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Citations
62 Claims
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1. A method of stacking semiconductor die comprising the acts of:
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a) picking up a first die having a topside and an underside with a die picking tool;
b) applying adhesive to the underside of the first die, thereby providing an adhesively coated underside of the first die; and
c) without releasing the first die from the die picking tool, picking up a second die having a topside and an underside by placing the adhesively coated underside of the first die against the topside of the second die, thereby forming a die stack. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of stacking semiconductor die comprising the acts of:
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(a) forming a stack of at least two semiconductor die; and
(b) placing the stack onto a temporary holding surface. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of testing semiconductor die comprising the acts of:
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(a) forming a stack of at least two semiconductor die; and
(b) after the stack is formed, testing the semiconductor die in the stack prior to attaching the semiconductor die to a packaging substrate. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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35. An integrated circuit comprising:
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a stack comprising at least two semiconductor die, each of the semiconductor die being coupled together by a first adhesive, the first adhesive being curable at a first temperature; and
a substrate coupled to one of the at least two semiconductor die by a second adhesive, the second adhesive being curable at a second temperature lower than the first temperature. - View Dependent Claims (36, 37, 38, 39)
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40. A system comprising:
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a processor; and
an integrated circuit coupled to the processor and comprising;
a stack comprising at least two semiconductor die, each of the semiconductor die being coupled together by a first adhesive, the first adhesive being curable at a first temperature; and
a substrate coupled to one of the at least two semiconductor die by a second adhesive, the second adhesive being curable at a second temperature lower than the first temperature. - View Dependent Claims (41, 42, 43, 44)
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- 45. An integrated circuit comprising a stack of at least two semiconductor die, each of the die being coupled to an adjacent die in the stack by a respective layer of adhesive prior to the stack being coupled to a packaging substrate.
- 50. A tape reel having a plurality of semiconductor die stacks thereon.
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56. A method of forming a semiconductor package comprising the acts of:
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picking a die stack from a temporary holding surface; and
placing the die stack on a substrate. - View Dependent Claims (57, 58, 59, 60, 61, 62)
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Specification