Circuit board

• US 20040056349A1
• Filed: 09/22/2003
• Published: 03/25/2004
• Est. Priority Date: 10/07/1994
• Status: Active Grant

• Current Assignee: Fitel USA Corporation
• Original Assignee: Fitel USA Corporation
• Inventors: Suzuki, Kazuhiro, Tanaka, Akira, Hosokawa, Takashi, Kobayashi, Isao, Shimizu, Hideo, Koike, Nobuya, Higashimura, Yutaka, Koike, Yoshihiko, Kokubun, Hideya, Kushima, Tadao, Onuki, Jin, Sekine, Shigeki, Sawahata, Mamoru, Kurihara, Yasutoshi, Haramaki, Takashi, Yamada, Kazuji, Saito, Ryuichi, Koizumi, Masahiro
• Granted Patent: US 7,141,741 B2
• Time in Patent Office: Days
• US Class Current: 257/724
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48011 Length
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49431 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/049 the other leads being perpendicular to the base
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01041 : Niobium [Nb]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01061 : Promethium [Pm]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1301 : Thyristor
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H02M 7/003 : Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

A semiconductor device in which electrodes of a plurality of semiconductor elements are bonded onto at least one of a plurality of electrode patterns on an insulator substrate, the other surface of the insulator substrate being bonded to a heat dissipating base. The upper surface of the heat dissipating base is covered with a member for cutting off the semiconductor elements from the outer environment. Terminals electrically connect the electrodes on said insulator substrate and the electrode placed outside the cutoff member. The material of the heat dissipating base has a linear expanding coefficient larger than that of the semiconductor element and smaller than three times that of the semiconductor element, and a thermal conductivity larger than 100 W/mK. The semiconductor elements are arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.

Claims

1. A circuit board comprising:

an insulator plate;

a first conductor layer provided on one surface of the insulator plate;

a second conductor layer provided in a position facing to the first conductor layer on the insulator plate; and

a conductor electrically connected to the first conductor layer and the second conductor layer.

2. A circuit board according to claim 1, which comprises a dielectric interposed between said first conductor layer and said second conductor layer.

3. A circuit board according to claim 1, wherein a position of an end portion of said second conductor layer is at a position of an end portion of said first conductor layer or at a position between the end portion of said first conductor layer and an end portion of said insulator plate.

4. A circuit board according to claim 1, wherein said second conductor layer comprises a layer selected from the group consisting of a metallized layer of tungsten, a metallized layer of molybdenum and manganese, a layer plated over a metallized layer of tungsten, and a layer plated over a metallized layer of molybdenum and manganese.

5. A circuit board comprising:

an insulator plate;

a first conductor layer provided on one surface of the insulator plate;

a second conductor layer separated from the conductor layer on the insulator plate; and

a conductor electrically connected to the first conductor layer and the second conductor layer.

6. A circuit board comprising:

an insulator plate;

a conductor layer placed on a surface of the insulator plate;

a dielectric layer provided in a gap portion between the insulator plate and the conductor layer wherein;

the following relationship exists among the dielectric constant of the dielectric layer ∈

_g, the dielectric constant of the insulator plate ∈

_b, the thickness of the gap portion L_g, and the thickness of the insulator plate L_b,

∈

_g≧

∈

_b×

(L_g/L_b).