Radiating structural body of electronic part and radiating sheet used for the radiating structural body
First Claim
1. A heat dissipating structure for a heat generating electronic component, characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.
1 Assignment
0 Petitions
Accused Products
Abstract
A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.
44 Citations
5 Claims
- 1. A heat dissipating structure for a heat generating electronic component, characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.
-
5. A heat dissipating sheet interposed between a heat generating electronic component and a heat dissipating member, characterized by comprising a metal sheet disposed on the side of the heat generating electronic component and a heat conductive member having adhesion stacked on the metal sheet and disposed on the side of the heat dissipating member, wherein the heat conductive member having adhesion is formed of a heat conductive composition comprising at least one resin component selected from among siloxane polymers, acrylic polymers and polyolefin polymers, and a heat conductive filler, the composition being able to phase change or soften by the heat from the electronic component during operation.
Specification