Solid state image pick-up device and camera using the solid state image pick-up device

• US 20040057719A1
• Filed: 09/22/2003
• Published: 03/25/2004
• Est. Priority Date: 09/20/2002
• Status: Abandoned Application

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Inui, Fumihiro, Itano, Tetsuya, Ogura, Masanori
• Application Number:
  US10/664,918
• Publication Number:
  US 20040057719A1
• Time in Patent Office: Days
• US Class Current: 396/439
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H04N 25/767 Horizontal readout lines, multiplexers or registers

Abstract

To suppress an influence exerted on an output video signal due to a high frequency noise from a scanning circuit. In a solid state image pick-up device including horizontal scanning circuits, and a vertical scanning circuit having a lower driving frequency than those of the horizontal scanning circuits which are arranged so as to be adjacent to different side portions of a square chip, pads are arranged at side portions of the chip, except for the side portions on the sides where the horizontal scanning circuits are arranged. The pads include pads through which a voltage or a ground potential is applied to active elements of pixels of a pixel region, pads through which voltages are inputted to amplifiers, and pads through which output signals of the amplifiers are outputted to the outside of the chip.

Claims

1. A solid state image pick-up device comprising:

a first scanning means; and

a second scanning means having a lower driving frequency than that of the first scanning means, the first scanning means and the second scanning means being arranged to be adjacent to different side portions of a chip, respectively,

wherein a predetermined pad is arranged in at least one of side portions of the chip, except for the side portion on a side where the first scanning means is arranged.

2. A solid state image pick-up device according to claim 1, further comprising a pixel region, on the chip, in which pixels having an active element are two-dimensionally arranged,

wherein the predetermined pad includes at least a pad through which a voltage or a ground potential is applied to the active element.

3. A solid state image pick-up device according to claim 2, wherein the active element comprises at least one selected from the group consisting of a transfer MOS transistor, a reset MOS transistor, a source follower input MOS transistor, and a selection MOS transistor.

4. A solid state image pick-up device according to claim 1, further comprising:

a pixel region, on the chip, in which pixels having an active element are two-dimensionally arranged; and

an amplifier for amplifying signal charges successively read out from the pixels of the pixel region by the first scanning means and the second scanning means,

wherein the predetermined pad includes at least a pad through which a voltage is inputted to the amplifier or an output signal of the amplifier is outputted to the outside of the chip.

5. A solid state image pick-up device according to claim 2, wherein the pixel region is formed into a rectangle, and the first scanning means is arranged closer to a long side of the pixel region.

6. A solid state image pick-up device according to claim 5, wherein the plurality of first scanning means are arranged to sandwich therebetween the pixel region.

7. A solid state image pick-up device according to claim 2, wherein the first scanning means comprises a horizontal shift register, and the second scanning means comprises a vertical shift register.

8. A camera, comprising:

the solid state image pick-up device according to claim 1;

a lens for forming an optical image of a subject; and

a signal processing unit for processing a signal from the solid state image pick-up device.