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Wafer bonding hermetic encapsulation

  • US 20040058476A1
  • Filed: 09/25/2002
  • Published: 03/25/2004
  • Est. Priority Date: 09/25/2002
  • Status: Active Grant
First Claim
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1. A method for packaging a device, comprising:

  • obtaining an encapsulating member configured to enclose said device;

    preparing a surface of said encapsulating member for non-adhesive direct bonding;

    preparing a surface area of a device carrier including the device for non-adhesive direct bonding; and

    bonding at near room temperature said prepared surface of the encapsulating member to said prepared surface of the device carrier to form an encapsulation of said device.

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