Microstimulator having self-contained power source

• US 20040059392A1
• Filed: 06/27/2003
• Published: 03/25/2004
• Est. Priority Date: 06/28/2002
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Inventors: Haller, Matthew I., McClure, Kelly H., Marnfeldt, Goran N., Parramon, Jordi
• Granted Patent: US 7,437,193 B2
• Time in Patent Office: Days
• US Class Current: 607/36
• CPC Class Codes: A61N 1/36007 of urogenital or gastrointestinal organs, e.g. for incontinence control
• CPC Class Codes: A61N 1/3605 Implantable neurostimulators for stimulating central or peripheral nerve system
• CPC Class Codes: A61N 1/37205 Microstimulators, e.g. implantable through a cannula
• CPC Class Codes: A61N 1/37217 characterised by the communication link, e.g. acoustic or tactile
• CPC Class Codes: A61N 1/37223 Circuits for electromagnetic coupling
• CPC Class Codes: A61N 1/37229 Shape or location of the implanted or external antenna
• CPC Class Codes: A61N 1/37235 Aspects of the external programmer
• CPC Class Codes: A61N 1/3727 characterised by the modulation technique
• CPC Class Codes: A61N 1/37276 characterised by means for reducing power consumption during telemetry
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: A61N 1/3787 from an external energy source
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H02J 2310/23 : The load being a medical device, a medical implant, or a life supporting device
• CPC Class Codes: H02J 50/10 : using inductive coupling
• CPC Class Codes: H02J 7/345 : using capacitors as storage or buffering devices
• CPC Class Codes: H04B 5/0037 : for power transfer
• CPC Class Codes: H04B 5/0081 : with antenna coils loop aerials H01Q7/00
• CPC Class Codes: H04B 5/26 : using coils
• CPC Class Codes: H04B 5/79 : for data transfer in combination with power transfer
• CPC Class Codes: H04L 27/02 : Amplitude-modulated carrier systems, e.g. using on-off keying; Single sideband or vestigial sideband modulation H04L27/32 takes precedence
• CPC Class Codes: H04L 27/10 : Frequency-modulated carrier systems, i.e. using frequency-shift keying H04L27/32 takes precedence
• CPC Class Codes: Y10T 29/4902 : Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 : by winding or coiling
• CPC Class Codes: Y10T 29/49073 : by assembling coil and core
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 29/49945 : by driven force fit
• CPC Class Codes: Y10T 29/49968 : Metal fusion joining
• CPC Class Codes: Y10T 428/12264 : having outward flange, gripping means or interlocking feature
• CPC Class Codes: Y10T 428/12271 : having discrete fastener, marginal fastening, taper, or end structure
• CPC Class Codes: Y10T 428/12347 : Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
• CPC Class Codes: Y10T 428/12375 : having member which crosses the plane of another member [e.g., T or X cross section, etc.]
• CPC Class Codes: Y10T 428/12396 : Discontinuous surface component
• CPC Class Codes: Y10T 428/12535 : with additional, spatially distinct nonmetal component
• CPC Class Codes: Y10T 428/12806 : Refractory [Group IVB, VB, or VIB] metal-base component

Abstract

An implantable microstimulator configured to be implanted beneath a patient'"'"'s skin for tissue stimulation to prevent and/or treat various disorders, e.g., neurological disorders, uses a self-contained power source such as a primary battery, a rechargeable battery, or other energy sources. For the rechargeable battery, and other energy sources that may require a periodic or occasional replenishment, such recharging or replenishment is accomplished, for example, by inductive coupling with an external device. A suitable bidirectional telemetry link allows the microstimulator system to inform the patient or clinician regarding the status of the system, including the charge level of the power source, and stimulation parameter states. Processing circuitry within the microstimulator automatically controls the applied stimulation pulses to match a set of programmed stimulation parameters established for a particular patient. The microstimulator preferably has a cylindrical hermetically sealed case having a length no greater than about 27 mm and a diameter no greater than about 3.3 mm. A reference electrode is located on one end of the case and an active electrode is located on the other end of the case. Further, the case is externally coated on selected areas with conductive and non-conductive materials.

Claims

1. An implantable electronic module, comprising:

an hermetically-sealed housing having a length no greater than about 27 mm and cross-sectional dimensions no greater than about 3.3 mm;

an electronic subassembly housed within said hermetically-sealed housing;

self-contained power source means contained within said hermetically-sealed housing and operatively connected to said electronic subassembly for providing operating power to said electronic subassembly;

a first electrode external to said hermetically-sealed housing and electrically coupled to said electronic subassembly;

a second electrode external to said hermetically-sealed housing and electrically coupled to said electronic subassembly;

an antenna coil within said hermetically-sealed housing; and

telemetry means, coupled to said antenna coil, for allowing data-containing signals to be received from and sent to an external device.

2. The electronic module of claim 1 wherein the electronic subassembly includes a ferrite core around which the antenna coil is wrapped.

3. The electronic module of claim 2 wherein the ferrite core includes a first half and a second half.

4. The electronic module of claim 3 wherein the self-contained power source is selected from the group comprising:

a primary battery, a rechargeable battery, a super capacitor, a nuclear battery, a mechanical resonator, an infrared collector, a thermally-powered energy source, a flexural powered energy source, a bioenergy power source, a fuel cell, a bioelectrical cell, and an osmotic pressure pump.

5. The electronic module of claim 4 wherein the hermetically-sealed housing comprises a tubular-shaped housing having a length no greater than about 27 mm and a diameter no greater than about 3.3 mm.

6. The electronic module of claim 4 wherein the electronic subassembly includes means for generating stimulation pulses that are applied through the first and second electrodes.

7. The electronic module of claim 6 wherein at least one of the first and second electrodes is carried on an external surface of said hermetically-sealed case.

8. The electronic module of claim 1 wherein the self-contained power source means comprises a primary battery.

9. The electronic module of claim 5 wherein the self-contained power source means further includes a super capacitor.

10. The electronic module of claim 1 wherein the self-contained power source means comprises a rechargeable battery.

11. The electronic module of claim 7 wherein the self-contained power source means further includes a super capacitor.

12. An implantable electronic module, comprising:

an hermetically-sealed housing having a length no greater than about 27 mm and cross-sectional dimensions no greater than about 3.3 mm;

an electronic subassembly housed within said hermetically-sealed housing;

self-contained power source means contained within said hermetically-sealed housing and operatively connected to said electronic subassembly for providing operating power to said electronic subassembly;

a first electrode external to said hermetically-sealed housing and electrically coupled to said electronic subassembly;

a second electrode external to said hermetically-sealed housing and electrically coupled to said electronic subassembly; and

telemetry means for allowing data-containing signals to be received from and sent to an external device.

13. The electronic module of claim 12 wherein the self-contained power source is selected from the group comprising:

a primary battery, a rechargeable battery, a super capacitor, a nuclear battery, a mechanical resonator, an infrared collector, a thermally-powered energy source, a flexural powered energy source, a bioenergy power source, a fuel cell, a bioelectrical cell, and an osmotic pressure pump.

14. The electronic module of claim 12 wherein the self-contained power source means comprises a primary battery.

15. The electronic module of claim 14 wherein the self-contained power source means further includes a super capacitor.

16. The electronic module of claim 12 wherein the self-contained power source means comprises a rechargeable battery.

17. The electronic module of claim 16 wherein the self-contained power source means further includes a super capacitor.

18. An implantable neural stimulator module, comprising:

an hermetically-sealed housing having a length no greater than about 30 mm and cross-sectional dimensions no greater than about 3.7 mm;

an electronic subassembly housed within said hermetically-sealed housing;

self-contained power source means contained within said hermetically-sealed housing and operatively connected to said electronic subassembly for providing operating power to said electronic subassembly;

a first electrode external to said hermetically-sealed housing and electrically coupled to said electronic subassembly;

a second electrode external to said hermetically-sealed housing and electrically coupled to said electronic subassembly; and

telemetry means for allowing data-containing signals to be received from and sent to an external device.

19. The implantable neural stimulator module of claim 18 wherein the self-contained power source means comprises a primary battery.

20. The implantable neural stimulator module of claim 18 wherein the self-contained power source means comprises a rechargeable battery.