Structure and method for connecting flexible printed circuit board to inkjet print head
First Claim
1. A method of connecting a plurality of lands provided on a flexible printed circuit board to a plurality of head terminals provided on an inkjet head, the method comprising:
- preparing a flexible printed circuit board which has an insulating member, a plurality of lands and a plurality of conductive wires being provided on the insulating member, each land being connected to a corresponding conductive wire, the plurality of lands being arranged on the insulating member at locations in one-to-one correspondence with a plurality of head terminals provided on an inkjet head, the insulating member having a plurality of through-holes each for exposing a portion of a corresponding land;
placing a conductive brazing material in the through-hole on each land;
facing the lands through the through-holes to the head terminals on the inkjet head; and
connecting and fixing the lands to the head terminals by melting the conductive brazing material.
1 Assignment
0 Petitions
Accused Products
Abstract
A plurality of lands and a plurality of conducting wires connected independently to each land are formed on one side surface of an insulating substrate of a flexible printed circuit board. Through-holes are formed through the insulating substrate for exposing the lands to the other side surface. Solder is provided in the through-holes. The solder connects the lands to the head terminals on an inkjet head, which is located facing the other side surface of the insulating substrate. The insulating substrate separates the solder from areas between the conducting wires and from areas between the lands, thereby preventing short circuits from occurring when manufacturing the connecting structure with a low tolerance grade.
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Citations
25 Claims
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1. A method of connecting a plurality of lands provided on a flexible printed circuit board to a plurality of head terminals provided on an inkjet head, the method comprising:
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preparing a flexible printed circuit board which has an insulating member, a plurality of lands and a plurality of conductive wires being provided on the insulating member, each land being connected to a corresponding conductive wire, the plurality of lands being arranged on the insulating member at locations in one-to-one correspondence with a plurality of head terminals provided on an inkjet head, the insulating member having a plurality of through-holes each for exposing a portion of a corresponding land;
placing a conductive brazing material in the through-hole on each land;
facing the lands through the through-holes to the head terminals on the inkjet head; and
connecting and fixing the lands to the head terminals by melting the conductive brazing material. - View Dependent Claims (2, 3, 4)
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5. A connecting method of connecting an inkjet head to a flexible printed circuit board, the inkjet head having a plurality of channels arranged in a staggered manner and having a surface on which a plurality of head terminals is formed in a staggered manner in correspondence with the plurality of channels, the flexible printed circuit board having a plurality of conductive lands for supplying control signals from a circuit board to the head terminals, the method comprising:
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forming, on one surface of a flexible belt-shaped insulating member, a plurality of conductive lands and a plurality of conducting wires, the plurality of conductive lands being formed in a staggered manner at positions corresponding to a plurality of head terminals on an inkjet head, the plurality of conducting wires being individually connected to respective ones of the plurality of lands;
forming a plurality of through-holes through the insulating member at positions corresponding to the lands for exposing a portion of each of the plurality of lands on another surface of the insulating member opposite to the one surface of the insulating member;
placing a conductive brazing material in the through-hole on each of the lands;
facing the lands through the through-hole to the head terminals; and
connecting and fixing the lands to the head terminals by melting the brazing material. - View Dependent Claims (6)
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7. A connecting method of connecting an inkjet head to a flexible printed circuit board, the inkjet head having a plurality of channels arranged in a staggered manner and having a surface on which a plurality of head terminals is formed in a staggered manner in correspondence with the plurality of channels, the flexible printed circuit board having a plurality of conductive lands for supplying control signals from a circuit board to the head terminals, the method comprising:
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forming, on a surface of a flexible belt-shaped insulating member, a plurality of conductive lands and a plurality of conducting wires, the plurality of conductive lands being formed in a staggered manner at positions corresponding to a plurality of head terminals on an inkjet head, the plurality of conducting wires being individually connected to respective ones of the plurality of lands;
covering the plurality of lands and the plurality of conductive wires on the surface of the insulating member with an insulating film, the insulating film having a plurality of through-holes for exposing a portion of each of the plurality of lands;
placing a conductive brazing material in each of the through-holes;
facing the lands through the through-hole to the head terminals; and
connecting and fixing the lands to the head terminals by melting the brazing material. - View Dependent Claims (8)
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9. A printed circuit board for being connected with an inkjet head having a surface on which a plurality of head terminals are arranged, the printed circuit board comprising:
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an insulating member; and
a plurality of lands and a plurality of conductive wires provided on the insulating member, each land being connected to a corresponding conductive wire, the plurality of lands being arranged on the insulating member at locations in one-to-one correspondence with a plurality of head terminals provided on an inkjet head, the insulating member being formed with a plurality of through-holes each for exposing a portion of a corresponding land, the lands facing through the through-holes to the head terminals on the inkjet head, the through-hole on each land receiving a conductive brazing material placed therein, the conductive brazing material being melted to connect and fix each land to the corresponding head terminal. - View Dependent Claims (10, 11, 12, 13)
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14. A connecting structure of a flexible printed circuit board for connecting an inkjet head to a circuit board, the inkjet head having a plurality of channels and a surface on which a plurality of head terminals is provided in correspondence with the plurality of channels, the circuit board generating control signals for applying drive voltages to the head terminals, thereby causing the channels to eject ink, the connecting structure comprising;
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a flexible belt-shaped insulating member having one surface and another surface opposite to each other, the one surface confronting a surface of an inkjet head on which a plurality of head terminals is provided;
a plurality of lands made of a conductive material and formed on the another surface of the insulating member at positions corresponding to the plurality of head terminals on the inkjet head, a plurality of through-holes being formed through the insulating member at positions corresponding to the lands for exposing a portion of each of the plurality of lands on the one surface of the insulating member;
a plurality of conducting wires formed on the another surface of the insulating member and individually connected to respective ones of the plurality of lands, the conductive wires supplying control signals from a circuit board to the lands; and
a conductive brazing material provided in each of the through-holes and electrically connecting the corresponding one of the lands to the corresponding head terminal - View Dependent Claims (15, 16)
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17. A connecting structure of a flexible printed circuit board for connecting an inkjet head to a circuit board, the inkjet head having a plurality of channels and a surface on which a plurality of head terminals is provided in correspondence with the plurality of channels, the circuit board generating control signals for applying drive voltages to the head terminals, thereby causing the channels to eject ink, the connecting structure comprising:
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a flexible belt-shaped insulating member having one surface, the one surface confronting a surface of an inkjet head on which a plurality of head terminals is provided;
a plurality of lands made of a conductive material and formed on the one surface of the insulating member at positions corresponding to the plurality of head terminals on the inkjet head;
a plurality of conducting wires formed on the one surface of the insulating member and individually connected to respective ones of the plurality of lands, the conductive wires supplying control signals from a circuit board to the lands;
an insulating film covering the plurality of lands and the plurality of conductive wires on the one surface of the insulating member, the insulating film having a plurality of through-holes for exposing at least a portion of each of the plurality of lands; and
a conductive brazing material provided in each of the through-holes and electrically connecting the corresponding one of the lands to the corresponding head terminal. - View Dependent Claims (18, 19)
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20. An inkjet head unit comprising:
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an inkjet head having a surface on which a plurality of head terminals are formed; and
a flexible printed circuit board connecting the inkjet head to a control circuit board generating a control signal to control the inkjet head, the flexible printed circuit board comprising;
a flexible insulating circuit substrate having one surface and another surface opposite to each other, the one surface confronting the surface of the inkjet head provided with the plurality of head terminals;
a plurality of lands made of a conductive material and formed on the another surface of the circuit substrate at positions corresponding to the plurality of head terminals on the inkjet head, a plurality of through-holes being formed through the circuit substrate at positions corresponding to the plurality of the lands, each of the plurality of through-holes exposing a part of the corresponding one of the plurality of lands on the one surface of the circuit substrate; and
a plurality of conductive wires formed on the another surface of the circuit substrate, each of the plurality of conductive wires electrically connecting one of the plurality of lands to the circuit board, the conductive wires supplying the control signals from the control circuit board to the lands;
whereinthe plurality of the lands is connected and fixed individually to respective ones of the plurality of head terminals by a conductive brazing material placed in the corresponding one of the plurality of through-holes. - View Dependent Claims (21)
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22. An inkjet head unit comprising:
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an inkjet head having a surface on which a plurality of head terminals are formed; and
a flexible printed circuit board connecting the inkjet head to a control circuit board generating a control signal to control the inkjet head, the flexible printed circuit board comprising;
a flexible insulating circuit substrate having a surface confronting a surface of the inkjet head on which a plurality of head terminals is provided;
a plurality of lands made of a conductive material and formed on the one surface of the circuit substrate at positions corresponding to the plurality of head terminals on the inkjet head;
a plurality of conductive wires formed on the one surface of the circuit substrate, each of the plurality of conductive wires electrically connecting one of the plurality of lands to the circuit board, the conductive wires supplying the control signals from the control circuit board to the lands; and
an electrically insulating film covering the plurality of lands and the plurality of conductive wires on the one surface of the circuit substrate, the electrically insulating film having a plurality of through-holes exposing a part of each of the plurality of lands;
whereinthe plurality of the lands are connected and fixed individually to respective ones of the plurality of head terminals on the inkjet head by a conductive brazing material placed in the corresponding one of the plurality of through-holes. - View Dependent Claims (23)
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24. A printed circuit board for connecting an inkjet head to a control unit, the inkjet head having a surface provided with a plurality of head terminals thereon, the control unit generating signals to control the inkjet head, the printed circuit board comprising:
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a flexible insulating substrate having a first surface and a second surface opposite to each other, the first surface confronting a surface of an inkjet head provided with a plurality of head terminals;
a plurality of conductive lands formed on the second surface of the insulating substrate at positions corresponding to the plurality of head terminals on the inkjet head, a plurality of through-holes being formed through the insulating substrate at positions corresponding to the lands for exposing a portion of each of the plurality of lands on the first surface of the insulating substrate, the plurality of through-holes receiving a brazing material therein; and
a plurality of conducting paths formed on the second surface of the insulating substrate and individually connected to respective ones of the plurality of lands, the conductive paths transferring controlling signals from the control unit to the lands.
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25. A printed circuit board for connecting an inkjet head to a control unit, the inkjet head having a surface provided with a plurality of head terminals thereon, the control unit generating signals to control the inkjet head, the printed circuit board comprising:
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a flexible insulating substrate having a surface confronting a surface of the inkjet head provided with a plurality of head terminals;
a plurality of conductive lands formed on the surface of the insulating substrate at positions corresponding to the plurality of head terminals on the inkjet head; and
a plurality of conducting paths formed on the surface of the insulating substrate and individually connected to respective ones of the plurality of lands, the conductive paths transferring signals from a control unit to the lands; and
an insulating film covering the plurality of lands and the plurality of conductive wires on the surface of the insulating substrate, the insulating film having a plurality s of through-holes for exposing a part of each of the plurality of lands, the plurality of through-holes receiving a conductive brazing material therein.
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Specification