Semiconductor multi-package module having wire bond interconnect between stacked packages

• US 20040061212A1
• Filed: 08/02/2003
• Published: 04/01/2004
• Est. Priority Date: 09/17/2002
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Lte.
• Original Assignee: Chippac Company Limited
• Inventors: Karnezos, Marcos
• Granted Patent: US 7,064,426 B2
• Time in Patent Office: Days
• US Class Current: 257/686
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1052 Wire or wire-like electrical connections
• CPC Class Codes: H01L 2225/1094 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3135 : Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/4334 : Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49833 : the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/5387 : Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/03 : all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A semiconductor multi-package module having stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.

Claims

1. A multi-package module comprising stacked lower and upper packages, each said package including a die attached to a substrate, wherein the upper and lower substrates are interconnected by wire bonding.

2. The multipackage module of claim 1 wherein at least one said package has wire bond interconnect of the die with the substrate.

3. The multipackage module of claim 1 wherein at least one said package has wire bond interconnect of the die with the substrate, and wherein the said package is fully encapsulated.

4. The multipackage module of claim 1 wherein at least one said package has wire bond interconnect of the die with the substrate, and wherein the said package is encapsulated only to an extent sufficient to protect the wire bonds between the die and the substrate.

5. The multipackage module of claim 1 wherein at least one said package is a ball grid array package.

6. The multipackage module of claim 1 wherein at least one said package is a land grid array package.

7. The multipackage module of claim 1 wherein at least one said package has flip chip interconnect of the die with the substrate.

8. The multipackage module of claim 1, further comprising a heat spreader.

9. The multipackage module of claim 1, further comprising an electromagnetic shield for at least one of the packages.

10. The multipackage module of claim 1, comprising a third stacked package.

11. A method for making a multipackage module, comprising

providing a first package including at least one die on a first package substrate,

placing over the first package a second package including at least one die on a second package substrate, and

forming wire bond z-interconnects between the first and second substrates.

12. The method of claim 11 wherein providing the first package comprises providing an unsingulated strip of packages.

13. The method of claim 11 wherein placing the second package over the first package comprises applying an adhesive onto an upper surface of the first substrate and placing the second package onto the adhesive.

14. The method of claim 13 wherein the adhesive is a curable adhesive, and further comprising curing the adhesive.

15. The method of claim 11 wherein providing the first package comprises testing packages for a performance and reliability requirement and selecting the first package as meeting the requirement.

16. The method of claim 11 wherein placing the second package over the first package comprises testing packages for a performance and reliability requirement and selecting the second package as meeting the requirement.

17. The method of claim 11, further comprising attaching second-level interconnect balls onto the first package substrate.

18. The method of claim 11, further comprising encapsulating the stacked packages in a multi-package module molding.