High power MCM package
First Claim
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1. A multichip module comprising:
- a substrate having a first conductive pad, a second conductive pad and a third conductive pad disposed on a major surface thereof;
a conductive element, said conductive element including a web portion and a connector extending from a first major surface of said web portion;
a first semiconductor die and a second semiconductor die, each semiconductor die having a first contact of a first designation disposed on a first major surface thereof and a second contact of a second designation disposed on a second opposing major surface thereof;
wherein said first contact of said first semiconductor die is electrically connected to said first conductive pad, said second contact of said second semiconductor die is connected to said second conductive pad, said connector is connected to said third conductive pad, and said second contact of said first semiconductor die and said first contact of said second semiconductor die are connected to said first major surface of said web portion.
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Abstract
A multi-chip module that includes a conductive element to serve as an electrical connector for electrically connecting respective electrical contacts of at least two power semiconductor devices and serving as an output connector. The conductive element improving heat transfer from the power semiconductor devices through the top of the module.
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Citations
31 Claims
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1. A multichip module comprising:
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a substrate having a first conductive pad, a second conductive pad and a third conductive pad disposed on a major surface thereof;
a conductive element, said conductive element including a web portion and a connector extending from a first major surface of said web portion;
a first semiconductor die and a second semiconductor die, each semiconductor die having a first contact of a first designation disposed on a first major surface thereof and a second contact of a second designation disposed on a second opposing major surface thereof;
wherein said first contact of said first semiconductor die is electrically connected to said first conductive pad, said second contact of said second semiconductor die is connected to said second conductive pad, said connector is connected to said third conductive pad, and said second contact of said first semiconductor die and said first contact of said second semiconductor die are connected to said first major surface of said web portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A multichip module comprising:
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a substrate having a first conductive pad, a second conductive pad and a third conductive pad disposed on a major surface thereof;
a conductive element, said conductive element including a web portion and a connector extending from a first major surface of said web portion;
a first MOSFET and a second MOSFET, each MOSFET having a source contact disposed on a first major surface thereof and a drain contact on a second opposing major surface thereof;
wherein said source contact of said first semiconductor die is electrically connected to said first conductive pad, said drain contact of said second semiconductor die is connected to said second conductive pad, said connector is connected to said third conductive pad, and said drain contact of said first semiconductor die and said source contact of said second semiconductor die are connected to said first major surface of said web portion. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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Specification