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High reliability multlayer circuit substrates and methods for their formation

  • US 20040061234A1
  • Filed: 09/26/2003
  • Published: 04/01/2004
  • Est. Priority Date: 09/27/2002
  • Status: Active Grant
First Claim
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1. A method for forming a multilayer circuit substrate, comprising:

  • providing a dielectric base substrate;

    forming conductors on the base substrate;

    forming sacrificial structures on the base substrate and conductors to define areas to be protected from deposition of a dielectric layer;

    vacuum depositing a dielectric thin film on the base substrate, the conductors and the sacrificial structures; and

    removing the sacrificial structures to leave a patterned deposited dielectric thin film on the conductors and the base substrate.

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