Fabricating complex micro-electromechanical systems using an intermediate electrode layer

• US 20040063239A1
• Filed: 09/27/2002
• Published: 04/01/2004
• Est. Priority Date: 09/27/2002
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Judy, Michael W., Yasaitis, John A., Felton, Lawrence E., Karpman, Maurice S., Yun, Chang-Han, Gormley, Colin
• Granted Patent: US 6,933,163 B2
• Time in Patent Office: Days
• US Class Current: 438/51
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers

Abstract

An intermediate electrode layer is used to fabricate an integrated micro-electromechanical system. An intermediate electrode layer is formed on an integrated circuit wafer. The intermediate electrode layer places drive electrodes a predetermined height above the surface of the integrated circuit wafer. A micro-electromechanical system wafer having micromachined optical mirrors is bonded to the integrated circuit wafer such that the drive electrodes are positioned a predetermined distance from the optical mirrors.

Claims

1. A method for fabricating an integrated micro-electromechanical system, the method comprising:

providing a first micromachined apparatus having at least one micromachined optical mirror;

providing a second micromachined apparatus;

forming an intermediate electrode structure having at least one electrode on the second micromachined apparatus; and

bonding the first micromachined apparatus to one of intermediate electrode structure and the second micromachined apparatus such that the at least one electrode is a predetermined distance from the at least one micromachined optical mirror.

2. The method of claim 1, wherein forming an intermediate electrode structure having at least one electrode on the second micromachined apparatus comprises:

forming the intermediate electrode structure separate from the second micromachined apparatus; and

bonding the intermediate electrode structure to the second micromachined apparatus.

3. The method of claim 1, wherein forming an intermediate electrode structure having at least one electrode on the second micromachined apparatus comprises:

forming the intermediate electrode structure directly on the second micromachined apparatus.

4. The method of claim 1, wherein bonding the first micromachined apparatus to one of intermediate electrode structure and the second micromachined apparatus such that the at least one electrode is a predetermined distance from the at least one micromachined optical mirror comprises:

aligning the at least one electrode with the at least one micromachined optical mirror.

5. The method of claim 1, wherein the first micromachined apparatus includes at least one offset structure, and wherein bonding the first micromachined apparatus to one of intermediate electrode structure and the second micromachined apparatus such that the at least one electrode is a predetermined distance from the at least one micromachined optical mirror comprises:

bonding the at least one offset structure to one of the intermediate electrode structure and the second micromachined apparatus.

6. The method of claim 1, wherein forming an intermediate electrode structure having at least one electrode on the second micromachined apparatus comprises:

forming the intermediate electrode structure from one of;

a polymer material; and

a photoresist material.

7. The method of claim 6, wherein the polymer material comprises one of:

a polymethyl methacrylate (PMMA) material; and

a polymethylglutarimide (PMGI) material.

8. The method of claim 6, wherein the photoresist material comprises an SU8 material.

9. The method of claim 1, wherein forming an intermediate electrode structure having at least one electrode on the second micromachined apparatus comprises:

forming the intermediate electrode structure using one of;

an electroplating technique;

a deposition technique; and

a photoresist technique.

10. An apparatus comprising:

a first micromachined wafer having an intermediate electrode structure formed thereon, the intermediate electrode structure having at least one electrode; and

a second micromachined wafer having at least one micromachined optical mirror, the second micromachined wafer bonded to at least one of the first micromachined wafer and the intermediate electrode structure such that the at least one electrode is a predetermined distance from the at least one micromachined optical mirror.

11. The apparatus of claim 10, wherein the intermediate electrode structure is formed directly on the first micromachined wafer.

12. The apparatus of claim 10, wherein the intermediate electrode structure is bonded to the first micromachined wafer.

13. The apparatus of claim 10, wherein the second micromachined wafer includes at least one offset structure, and wherein the at least one offset structure is bonded to one of the intermediate electrode structure and the second micromachined apparatus.

14. The apparatus of claim 10, wherein the intermediate electrode structure comprises one of:

a polymer material; and

a photoresist material.

15. The apparatus of claim 14, wherein the polymer material comprises one of:

a polymethyl methacrylate (PMMA) material; and

a polymethylglutarimide (PMGI) material.

16. The apparatus of claim 14, wherein the photoresist material comprises an SU8 material.

17. The apparatus of claim 10, wherein the intermediate electrode structure is formed using one of:

an electroplating technique;

a deposition technique; and

a photoresist technique.

18. An apparatus comprising:

a first micromachined wafer having at least one micromachined optical mirror and at least one offset structure;

a second micromachined wafer; and

an intermediate electrode structure having at least one electrode, the intermediate electrode interposed between the first micromachined wafer and the second micromachined wafer such that the at least one electrode is a predetermined distance from the at least one micromachined optical mirror.

19. The apparatus of claim 18, wherein the intermediate electrode structure comprises one of:

a polymer material; and

a photoresist material.

20. The apparatus of claim 19, wherein the polymer material comprises one of:

a polymethyl methacrylate (PMMA) material; and

a polymethylglutarimide (PMGI) material.

21. The apparatus of claim 19, wherein the photoresist material comprises an SU8 material.