Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages

• US 20040063246A1
• Filed: 08/02/2003
• Published: 04/01/2004
• Est. Priority Date: 09/17/2002
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Original Assignee: Chippac Company Limited
• Inventors: Karnezos, Marcos
• Granted Patent: US 7,053,476 B2
• Time in Patent Office: Days
• US Class Current: 438/108
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1052 Wire or wire-like electrical connections
• CPC Class Codes: H01L 2225/1094 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A semiconductor multi-package module having stacked second and first packages, each package including a die attached to a substrate, in which the first and second package substrates are interconnected by wire bonding, and in which the first package is a flip chip ball grid array package in a die-down configuration. Also, a method for making a semiconductor multi-package module, by providing a first package including a first package substrate and having a die-down flip chip configuration, affixing a second package including a second package substrate an upper surface of the first package, and forming z-interconnects between the first and second package substrates.

Claims

1. A multi-package module comprising stacked first and second packages, each said package including a die attached to a substrate, wherein the first and second substrates are interconnected by wire bonding, and wherein the first package comprises a flip-chip ball grid array package having a flip-chip in a die-down configuration.

2. The multi-package module of claim 1 wherein the second package is a wire bonded land grid array package.

3. The multi-package module of claim 2 wherein the die and wire bonds in the second package are fully encapsulated with a molding material.

4. The multi-package module of claim 2 wherein the second package is peripherally encapsulated to an extent sufficient to cover the wire bonds between the die and the substrate.

5. The multi-package module of claim 2 wherein the second package substrate is a single-metal layer substrate.

6. The multi-package module of claim 1 wherein the flip chip package is provided with an electrical shield.

7. The multi-package module of claim 6 wherein the electrical shield is configured to serve as a heat spreader.

8. The multi-package module of claim 1 wherein the flip chip package includes an RF die.

9. The multi-package module of claim 6 wherein the flip chip package includes an RF die, and the shield serves to limit electromagnetic interference between the RF die and other die in the multi-package module.

10. The multi-package module of claim 1 wherein the first package is provided with an electrical shield.

11. The multi-package module of claim 1 wherein the second package is a stacked die package.

12. The multi-package module of claim 11 wherein adjacent stacked die in the stacked die package are separated by spacers.

13. The multi-package module of claim 1 wherein the second package is stacked over the first package, and wherein the flip-chip die on the first package is provided with an electrical shield.

14. The multi-package module of claim 1 wherein the first package substrate includes an embedded ground plane.

15. The multi-package module of claim 14, the ground plane being configured to serve for heat dissipation.

16. The multi-package module of claim 14, the ground plane being configured to serve as an electrical shield.

17. The multi-package module of claim 1 wherein at least one of the first and the second package is a stacked-die package.

18. The multi-package module of claim 1 wherein the second package is a stacked-die package.

19. The multi-package module of claim 1, further comprising a heat shield.

39. A mobile communications device comprising a multi-package module according to claim 1.

40. A computer comprising a multi-package module according to claim 1.

20. A method for making a multi-package module, comprising

providing a die-down flip chip first package including a first package substrate,

providing a second package including a die and a second package substrate,

stacking the second package over the first package, and

electrically interconnecting the first and second packages by wire bonds connecting the first package substrate and the second package substrate.

21. The method of claim 20 wherein providing a die-down flip chip first package comprises providing an unsingulated strip of die-down flip chip first packages.

22. The method of claim 20 wherein providing a die-down flip chip first package comprises testing die-down flip chip packages for a performance and reliability requirement, and selecting a package meeting the said requirement as a said first package.

23. The method of claim 20 wherein providing a second package comprises testing packages for a performance and reliability requirement, and selecting a package meeting the said requirement as a said second package.

24. The method of claim 20 wherein providing a second package comprises providing a land grid array package.

25. The method of claim 20 wherein stacking the second package over the first package comprises affixing the second package onto an upper surface of the die-down flip chip die.

26. The method of claim 20 wherein affixing the second package onto an upper surface of the die-down flip chip die comprises applying an adhesive onto the upper surface of the die and contacting the second package with the adhesive.

27. The method of claim 26 wherein applying the adhesive comprises applying a curable adhesive, and further comprising curing the adhesive.

28. The method of claim 20, further comprising attaching second-level interconnect balls onto the first substrate.

29. The method of claim 20, further comprising encapsulating features over the first substrate with a molding compound.

30. The method of claim 21, further comprising singulating the completed module from the strip.

31. The method of claim 20, further comprising providing the first package with an electromagnetic shield.

32. The method of claim 20, further comprising providing the module with a heat spreader.

33. The method of claim 32 wherein providing the module with a heat spreader comprises performing a drop-in molding operation.

34. The method of claim 32 wherein providing the module with a heat spreader comprises affixing a generally planar heat spreader onto an upper surface of the second package.

35. The method of claim 31 wherein providing the first package with an electromagnetic shield comprises affixing a shield over the die-down flip chip die.

36. The method of claim 35 wherein stacking the second package over the first package comprises affixing the second package onto an upper surface of the shield.

37. The method of claim 36 wherein affixing the second package onto an upper surface of the shield comprises applying an adhesive onto the upper surface of the shield and contacting the second package with the adhesive.

38. The method of claim 37 wherein applying the adhesive comprises applying a curable adhesive, and further comprising curing the adhesive.