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Semiconductor etching paste and the use thereof for localized etching of semiconductor substrates

  • US 20040063326A1
  • Filed: 06/27/2003
  • Published: 04/01/2004
  • Est. Priority Date: 07/01/2002
  • Status: Active Grant
First Claim
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1. A method of etching a semiconductor substrate, the method comprising the steps of:

  • applying an etching paste comprising an etchant to a part or a layer of the substrate; and

    heating the substrate, such that the part or the layer of the substrate upon which the etching paste has been applied is etched.

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