Solvent-free moisture-curable hot melt urethane resin composition

• US 20040063869A1
• Filed: 09/24/2003
• Published: 04/01/2004
• Est. Priority Date: 09/27/2002
• Status: Abandoned Application

• Current Assignee: Dainippon Ink and Chemicals Incorporated
• Original Assignee: Dainippon Ink and Chemicals Incorporated
• Inventors: Tanaka, Kojiro, Minamida, Yukihiko, Imanaka, Masayoshi
• Application Number:
  US10/668,964
• Publication Number:
  US 20040063869A1
• Time in Patent Office: Days
• US Class Current: 525/452
• CPC Class Codes: C08G 18/12 using two or more compounds having active hydrogen in the first polymerisation step
• CPC Class Codes: C08G 18/2018 having one nitrogen atom in the ring
• CPC Class Codes: C08G 18/307 Atmospheric humidity
• CPC Class Codes: C08G 18/4202 Two or more polyesters of different physical or chemical nature C08G18/44 takes precedence
• CPC Class Codes: C08G 2170/20 Compositions for hot melt adhesives

Abstract

An isocyanate group-containing hot melt urethane prepolymer, a morpholine ether-based crosslinking catalyst, and at least one sulfur atom-containing organic acid selected from the group consisting of sulfonic acids and sulfinic acids are used as essential components. The urethane prepolymer is a compound having an isocyanate group capable of reacting with moisture in the air or a substrate to be coated to form a crosslinked structure in the molecule. The morpholine ether-based crosslinking catalyst contributes to the moisture-crosslinking reactivity at room temperature. The sulfur atom-containing organic acid contributes to an improvement in thermal stability during melting.

Claims

1. A solvent-free moisture-curable hot melt urethane resin composition comprising an isocyanate group-containing hot melt urethane prepolymer (A), a morpholine ether-based crosslinking catalyst (B), and at least one sulfur atom-containing organic acid (C) selected from the group consisting of sulfonic acids and sulfinic acids as essential components.

2. The solvent-free moisture-curable hot melt urethane resin composition according to claim 1, wherein the isocyanate group-containing hot melt urethane prepolymer (A) is a urethane prepolymer having an isocyanate group originated from diphenylmetane diisocyanates at a molecular end.

3. The solvent-free moisture-curable hot melt urethane resin composition according to claim 1, wherein the morpholine ether-based crosslinking catalyst (B) comprises 2,2′

-dimorpholino diethyl ether and/or di(2,6-dimethylmorpholinoethyl)ether.

4. The solvent-free moisture-curable hot melt urethane resin composition according to claim 1, wherein the sulfur atom-containing organic acid (C) comprises methanesulfonic acid and/or ethanesulfonic acid.