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Microelectronic package having improved light extraction

  • US 20040065886A1
  • Filed: 11/20/2003
  • Published: 04/08/2004
  • Est. Priority Date: 11/16/2000
  • Status: Active Grant
First Claim
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1. A light-emitting package comprising:

  • a substantially transparent substrate having a first surface and a second surface including a lens; and

    a light-emitting diode (LED) adapted to emit light having a predetermined wavelength, said LED being secured over the first surface of said substantially transparent substrate, wherein the second surface of said substrate defines a principal light emitting surface of said package, and wherein said lens at said second surface has a grating pattern that matches the predetermined wavelength of the light emitted from said LED for controlling the emission geometry of the light emitted by said package.

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