Electrically isolated liquid metal micro-switches for integrally shielded microcircuits

• US 20040066259A1
• Filed: 08/12/2003
• Published: 04/08/2004
• Est. Priority Date: 10/08/2002
• Status: Active Grant

• Current Assignee: John F. Casey, Lewis R. Dove, Marvin Glenn Wong
• Original Assignee: John F. Casey, Lewis R. Dove, Marvin Glenn Wong
• Inventors: Casey, John F., Wong, Marvin Glenn, Dove, Lewis R.
• Granted Patent: US 6,781,075 B2
• Time in Patent Office: Days
• US Class Current: 335/78
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 2029/008 using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
• CPC Class Codes: H01H 2061/006 Micromechanical thermal relay
• CPC Class Codes: H01H 29/28 with level of surface of contact liquid displaced by fluid pressure
• CPC Class Codes: H01H 61/00 Electrothermal relays thermal switches not operated by electrical input, thermal switches with anticipating electrical input H01H37/00; thermally-sensitive members H01H37/32

Abstract

Liquid metal micro-switches. Liquid metal micro-switches and techniques for fabricating them in integrally shielded microcircuits are disclosed. The liquid metal micro-switches can be integrated directly into the construction of shielded thick film microwave modules. This integration is useful in applications requiring high frequency switching with high levels of electrical isolation.

Claims

1. A liquid metal micro-switch, comprising:

a first substrate;

a first ground plane attached to the first substrate;

a first dielectric layer attached to the first ground plane;

a conductive signal layer attached to the first dielectric layer and patterned so as to define first and second signal conductors having respectively first and second micro-switch contacts;

a second dielectric layer attached to the signal layer conductors and to the first dielectric layer;

a second ground plane attached to the second dielectric layer;

a second substrate attached to the second dielectric layer and having a cavity;

a third ground plane attached to the second substrate;

a heater positioned inside the cavity;

a main channel partially filled with a liquid metal, wherein the main channel encompasses the micro-switch contacts;

a sub-channel connecting the cavity and main channel, wherein a gas fills the cavity and sub-channel and wherein heater activation forces a change in electrical connectivity between first and second micro-switch contacts.

2. The liquid metal micro-switch as recited in claim 1, wherein the forced change in electrical connectivity results in an open circuit between the first and the second micro-switch contacts.

3. The liquid metal micro-switch as recited in claim 1, wherein the forced change in electrical connectivity results in a short circuit between the first and the second micro-switch contacts.

4. The liquid metal micro-switch as recited in claim 1, further comprising:

an additional heater positioned inside an additional cavity;

an additional sub-channel connecting the additional cavity and main channel, wherein an additional gas fills the additional cavity and the additional sub-channel, wherein the conductive signal layer is patterned so as to define a third signal conductor having a third micro-switch contact, and wherein activation of the additional heater subsequent to deactivation of the other heater forces a change in electrical connectivity between second and third micro-switch contacts and an opposite change in electrical connectivity between first and second micro-switch contacts.

5. The liquid metal micro-switch as recited in claim 4, wherein the change in electrical connectivity forced by activation of the additional heater results in an open circuit between the first and the second micro-switch contacts and in a short circuit between the second and the third micro-switch contacts.

6. The liquid metal micro-switch as recited in claim 4, wherein the change in electrical connectivity forced by activation of the additional heater results in a short circuit between the first and the second micro-switch contacts and in an open circuit between the second and the third micro-switch contacts.

7. The liquid metal micro-switch as recited in claim 4, wherein the additional gas is nitrogen.

8. The liquid metal micro-switch as recited in claim 1, wherein the first dielectric layer is a material selected from the group consisting of KQ-120 and KQ-CL907406.

9. The liquid metal micro-switch as recited in claim 1, wherein the second dielectric layer is a material selected from the group consisting of KQ-120 and KQ-CL907406.

10. The liquid metal micro-switch as recited in claim 1, wherein the gas is nitrogen.

11. The liquid metal micro-switch as recited in claim 1, wherein the liquid metal is selected from the group consisting of mercury and an alloy comprising gallium.

12. The liquid metal micro-switch as recited in claim 1, wherein the first substrate is a ceramic material.

13. The liquid metal micro-switch as recited in claim 1, wherein the second substrate is a glass material.

14. The liquid metal micro-switch as recited in claim 1, wherein the second substrate is hermetically sealed to the second ground plane.

23. The liquid metal micro-switch as recited in claim 11, wherein the second dielectric layer is a material selected from the group consisting of KQ-120 and KQ-CL907406.

24. The liquid metal micro-switch as recited in claim 11, wherein the gas is nitrogen.

25. The liquid metal micro-switch as recited in claim 11, wherein the liquid metal is selected from the group consisting of mercury and an alloy comprising gallium.

26. The liquid metal micro-switch as recited in claim 11, wherein the first substrate is a ceramic material.

27. The liquid metal micro-switch as recited in claim 11, wherein the second substrate is a ceramic material.

28. The liquid metal micro-switch as recited in claim 11, wherein the second substrate is hermetically sealed to the second ground plane.

15. A liquid metal micro-switch, comprising:

a first substrate;

a first ground plane attached to the first substrate;

a first dielectric layer attached to the first ground plane;

a conductive signal layer attached to the first dielectric layer and patterned so as to define first and second signal conductors having respectively first and second micro-switch contacts;

a second substrate;

a second ground plane attached to the second substrate;

a second dielectric layer attached to the second substrate, having a cavity, and attached to the first dielectric layer;

a heater positioned inside the cavity;

a main channel partially filled with a liquid metal, wherein the main channel encompasses the micro-switch contacts;

a sub-channel connecting the cavity and main channel, wherein a gas fills the cavity and sub-channel and wherein heater activation forces a change in electrical connectivity between first and second micro-switch contacts.

16. The liquid metal micro-switch as recited in claim 15, wherein the forced change in electrical connectivity results in an open circuit between the first and the second micro-switch contacts.

17. The liquid metal micro-switch as recited in claim 15 wherein the forced change in electrical connectivity results in a short circuit between the first and the second micro-switch contacts.

18. The liquid metal micro-switch as recited in claim 15, further comprising:

an additional heater positioned inside an additional cavity;

an additional sub-channel connecting the additional cavity and main channel, wherein an additional gas fills the additional cavity and the additional sub-channel, wherein the conductive signal layer is further patterned so as to define a third signal conductor having a third micro-switch contact, and wherein activation of the additional heater subsequent to deactivation of the other heater forces a change in electrical connectivity between second and third micro-switch contacts and an opposite change in electrical connectivity between first and second micro-switch contacts.

19. The liquid metal micro-switch as recited in claim 18, wherein the change in electrical connectivity forced by activation of the additional heater results in an open circuit between the first and the second micro-switch contacts and in a short circuit between the second and the third micro-switch contacts.

20. The liquid metal micro-switch as recited in claim 18, wherein the change in electrical connectivity forced by activation of the additional heater results in a short circuit between the first and the second micro-switch contacts and in an open circuit between the second and the third micro-switch contacts.

21. The liquid metal micro-switch as recited in claim 18, wherein the additional gas is nitrogen.

22. The liquid metal micro-switch as recited in claim 15, wherein the first dielectric layer is a material selected from the group consisting of KQ-120 and KQ-CL907406.

29. A method for fabricating a liquid metal micro-switch, comprising:

attaching a first ground plane to a first substrate;

attaching a first dielectric layer to the first ground plane;

attaching a conductive signal layer to the first dielectric layer;

patterning the conductive signal layer so as to define first and second signal conductors having respectively first and second micro-switch contacts;

attaching a second dielectric layer to the first and second signal conductors and to the first dielectric layer;

patterning the second dielectric layer so as to define at least one sub-channel and a main channel;

attaching a second ground plane to the second dielectric layer;

creating a cavity in a second substrate;

attaching a third ground plane to the second substrate;

attaching a heater inside the cavity;

partially filling the main channel with a liquid metal, wherein the main channel encompasses the micro-switch contacts; and

attaching the second substrate and the third ground plane to the second ground plane and the second dielectric layer.

30. A method for fabricating a liquid metal micro-switch, comprising:

attaching a first ground plane to a first substrate;

attaching a first dielectric layer to the first ground plane;

attaching a conductive signal layer to the first dielectric layer;

patterning the conductive signal layer so as to define first and second signal conductors having respectively first and second micro-switch contacts;

attaching a second ground plane to a second substrate;

attaching a second dielectric layer to the second substrate;

patterning the second dielectric layer so as to define a cavity, at least one sub-channel, and a main channel;

attaching a second dielectric layer to first and second signal conductors and to the first dielectric layer;

attaching a heater inside the cavity;

partially filling the main channel a liquid metal, wherein the main channel encompasses the micro-switch contacts; and

attaching the second dielectric layer to the conductive signal layer and to the first dielectric layer.