Encapsulation of a display element and method of forming the same

• US 20040069017A1
• Filed: 10/07/2003
• Published: 04/15/2004
• Est. Priority Date: 10/09/2001
• Status: Abandoned Application

• Current Assignee: Delta Optoelectronics, Inc. (Delta Electronics Incorporated)
• Original Assignee: Delta Optoelectronics, Inc. (Delta Electronics Incorporated)
• Inventors: Li, Chien-Hsing, Chen, Chun-Chien, Chen, Lai-Cheng, Tsai, Jiun-Wei, Yeh, Cheng-Nan
• Application Number:
  US10/679,394
• Publication Number:
  US 20040069017A1
• Time in Patent Office: Days
• US Class Current: 65/43
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/8428 Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
• CPC Class Codes: H10K 50/87 Arrangements for heating or cooling
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8723 Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
• CPC Class Codes: H10K 59/8794 Arrangements for heating and cooling

Abstract

A display element has a luminescent body formed on a glass substrate, a glass cap with the rim bonded to the rim of the glass substrate, and a sealing layer of frit formed on the bonding region between the glass substrate and the glass cap. In encapsulating, the display element is placed between a pedestal an a pressing plate, and then a high-power laser beam is provided to penetrate the glass cap to focus on the sealing layer, resulting in sintering frit. Also, pressure is applied to the pedestal and the pressing plate.

Claims

1. A method of encapsulating a display element, comprising steps of:

providing an organic light emitting diode or a plastic light emitting diode, comprising a luminescent body formed on a glass substrate and a glass cap with a rib structure formed on the bottom surface thereof;

coating a sealing layer of frit on the rim of the glass cap and surrounding the rib structure;

providing a pedestal on which the display element is placed;

providing a pressing plate disposed on the display element;

providing a high-power beam penetrating the glass cap to focus on the sealing layer so as to sinter the frit; and

applying pressure on the pedestal and the pressing plate.

2. The method of encapsulating a display element according to claim 1, wherein the pedestal and the pressing plate are of metal materials with good thermal conductivity.

3. The method of encapsulating a display element according to claim 1, wherein the high-power beam is a laser beam.

4. The method of encapsulating a display element according to claim 1, wherein the laser beam has a wavelength exceeding 550 nm.

5. The method of encapsulating a display element according to claim 1, wherein the high-power beam is an infrared ray.

6. The method of encapsulating a display element according to claim 1, wherein the infrared ray has a wavelength exceeding 800 nm.

7. The method of encapsulating a display element according to claim 1, wherein the rib structure is frit.

8. The method of encapsulating a display element according to claim 1, wherein the rib structure is of ceramic materials.

9. The method of encapsulating a display element according to claim 1, wherein the luminescent body is laminated with at least an anode layer, an organic luminescent layer and a cathode layer.