Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
First Claim
1. A substrate preparation system, comprising:
- a head having a head surface, the head surface configured to be proximate to a surface of the substrate when in operation;
a first conduit for delivering a first fluid to the surface of the substrate through the head;
a second conduit for delivering a second fluid to the surface of the substrate through the head, the second fluid being different than the first fluid; and
a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate, the first conduit, the second conduit and the third conduit configured to act substantially simultaneously when in operation.
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Accused Products
Abstract
One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously.
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Citations
49 Claims
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1. A substrate preparation system, comprising:
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a head having a head surface, the head surface configured to be proximate to a surface of the substrate when in operation;
a first conduit for delivering a first fluid to the surface of the substrate through the head;
a second conduit for delivering a second fluid to the surface of the substrate through the head, the second fluid being different than the first fluid; and
a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate, the first conduit, the second conduit and the third conduit configured to act substantially simultaneously when in operation. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method for processing substrate, comprising:
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applying a first fluid onto a surface of a substrate;
applying a second fluid onto the surface of the substrate, the second fluid being applied in close proximity to the application of the first fluid; and
removing the first fluid and the second fluid from the surface of the substrate, the removing being processed just as first fluid and the second fluid are applied to the surface of the substrate;
wherein the applying and the removing forming a controlled meniscus. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A substrate preparation apparatus to be used in substrate processing operations, comprising:
a proximity head being configured to move toward a substrate surface, the proximity head including, at least one of a first source inlet, the first source inlet being configured to apply a first fluid towards the substrate surface when the proximity head is in a position that is close to the substrate surface, at least one of a second source inlet, the second source inlet being configured to apply a second fluid towards the substrate surface when the proximity head is in the position that is close to the substrate surface, and at least one of a source outlet, the source outlet being configured to apply a vacuum pressure to remove the first fluid, the second fluid from the substrate surface when the proximity head is in the position that is close to the substrate surface. - View Dependent Claims (35, 36, 37, 38, 39, 40, 41)
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42. A substrate preparation apparatus to be used in substrate processing operations, comprising:
a proximity head carrier assembly configured to travel in a linear movement along a radius of a substrate, the proximity head carrier assembly including, a first proximity head being disposed over a substrate;
a second proximity head being disposed under the substrate;
an upper arm connected with the first proximity head, the upper arm being configured so the first proximity head is movable into close proximity over the substrate to initiate substrate preparation; and
a lower arm connected with the second proximity head, the lower arm being configured so the second proximity head is movable into close proximity under the substrate to initiate substrate preparation. - View Dependent Claims (43, 44, 45, 46, 47, 48, 49)
Specification