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Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces

  • US 20040069329A1
  • Filed: 09/30/2002
  • Published: 04/15/2004
  • Est. Priority Date: 06/30/2000
  • Status: Active Grant
First Claim
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1. A substrate preparation system, comprising:

  • a head having a head surface, the head surface configured to be proximate to a surface of the substrate when in operation;

    a first conduit for delivering a first fluid to the surface of the substrate through the head;

    a second conduit for delivering a second fluid to the surface of the substrate through the head, the second fluid being different than the first fluid; and

    a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate, the first conduit, the second conduit and the third conduit configured to act substantially simultaneously when in operation.

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