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Sputtering targets and method for the preparation thereof

  • US 20040069623A1
  • Filed: 04/17/2003
  • Published: 04/15/2004
  • Est. Priority Date: 01/05/1996
  • Status: Abandoned Application
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1. A process for the preparation of a sputtering target which comprises sub-stoichiometric titanium dioxide, TiOx, where x is below 2 having an electrical resistivity of less than 0.5 ohm.cm, optionally together with niobium oxide, which process comprises plasma spraying titanium dioxide, TiO2, optionally together with niobium oxide, onto a target base in an atmosphere which is oxygen deficient and which does not contain oxygen-containing compounds, the target base being coated with TiOx which is solidified by cooling under conditions which prevent the sub-stoichiometric titanium dioxide from combining with oxygen.

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